Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Phone Maw Hla"'
Publikováno v:
Soldering & Surface Mount Technology, 2007, Vol. 19, Issue 4, pp. 18-24.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/09540910710848518
Autor:
Marco Rovitto, Claudio Maria Villa, Jing En Luan, Phone Maw Hla, Roseanne Duca, Arianna Morelli, Carlo Passagrilli
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Controlling warpage in backend manufacturing is a challenge that needs to be tackled in early design stage. Failure to do so may result in later manufacturability or reliability issues. This is of particular importance in BGA automotive packages wher
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdda451f73523b631f8cf3d2b1d0dff9
https://doi.org/10.1109/eptc.2018.8654402
https://doi.org/10.1109/eptc.2018.8654402
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Understanding and predicting warpage behavior during backend process is key to avoiding workability issues during manufacturing and later reliability issues during testing or during the device operational lifetime. To achieve this several challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54f2021fd5cecb21b260057075a7420f
https://doi.org/10.1109/eurosime.2018.8369877
https://doi.org/10.1109/eurosime.2018.8369877
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
This paper provides a comprehensive study done experimentally and numerically to understand which are the key factors effecting block warpage and propose a practical modeling method for BOM selection based on the design for manufacturability approach
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e446346c04437dba57bffc9d470cc3ea
https://doi.org/10.1109/eptc.2017.8277509
https://doi.org/10.1109/eptc.2017.8277509