Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Philippe Verpoort"'
Autor:
Philippe Verpoort, Ansbert De Cleene, Tim Verdonck, Dipanjan Banerjee, Kristof Van Hecke, Rik Van Deun, Joost De Strycker, Peter Nockemann
Publikováno v:
Dalton Transactions. 48:2318-2327
In the last decade, deep eutectic solvents (DES) have risen as promising and cheap alternatives for the often expensive and moisture-sensitive ionic liquids. For the application in metal processing industries such as hard chrome plating, still very l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::04ead4fabe5f3054fb9a20f6497c775e
https://doi.org/10.1039/c8dt04292f
https://doi.org/10.1039/c8dt04292f
Autor:
Philippe Verpoort, Dipanjan Banerjee, Rik Van Deun, Kristof Van Hecke, Joost De Strycker, Peter Nockemann, Ansbert De Cleene, Tim Verdonck
Publikováno v:
Green Chemistry. 21:3637-3650
Deep eutectic solvents (DESs) based on choline chloride, chromium chloride, and their mixtures with water are emerging as one of the most promising sustainable alternatives to the banned and carcinogenic Cr(VI) electroplating process (REACH Annex XVI
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e23c9f63e250331c29656564a4822142
https://doi.org/10.1039/c9gc00690g
https://doi.org/10.1039/c9gc00690g
Publikováno v:
Solid State Phenomena. 134:91-94
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41c5289885aff44c1c18be45f5cc4974
https://doi.org/10.4028/www.scientific.net/ssp.134.91
https://doi.org/10.4028/www.scientific.net/ssp.134.91
Publikováno v:
Journal of Electroanalytical Chemistry. 411:67-72
The electrochemical and etching behaviour of n- and p-(100)GaAs in aqueous iodic acid solutions (pH 0) was studied by rotating-(ring)-disk voltammetry, impedance measurements and etch rate measurements. Under all circumstances, a competition for HIO3
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86845c0c224753f16ef17cc686c9e42f
https://doi.org/10.1016/0022-0728(96)04567-6
https://doi.org/10.1016/0022-0728(96)04567-6
Publikováno v:
2006 IEEE International Reliability Physics Symposium Proceedings.
Centrifugal spray process technology provides a cost-effective and environment-friendly wafer-cleaning solution, and has been considered a good alternative to "wet bench" cleans according to K. K. Christenson (1997), and E. Olson and B. J. Palla (200
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b4ac9d28a51969725a44356bc1aba50
https://doi.org/10.1109/relphy.2006.251306
https://doi.org/10.1109/relphy.2006.251306
Publikováno v:
2005 International Conference on Integrated Circuit Design and Technology, 2005. ICICDT 2005..
During the processing of CMOS with embedded NVM, an issue with the tunnel oxide was discovered. On part of the wafer, the tunnel oxide was very leaky and had a charge to breakdown (QBD) that was close to zero. The sensitivity of a capacitor test stru
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a839d068720b2645d6ee62b92cb3aee8
https://doi.org/10.1109/icicdt.2005.1502602
https://doi.org/10.1109/icicdt.2005.1502602