Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Philippe Renaux"'
Autor:
Skandar Basrour, J S Danel, F. Bernard, Thomas Sednaoui, Fabrice Casset, Cedrick Chappaz, Philippe Renaux, B. Desloges, S. Fanget
Publikováno v:
Mechatronics
Mechatronics, 2016, 40, pp.264-269. ⟨10.1016/j.mechatronics.2016.05.014⟩
Mechatronics, Elsevier, 2016, 40, pp.264-269. ⟨10.1016/j.mechatronics.2016.05.014⟩
Mechatronics, 2016, 40, pp.264-269. ⟨10.1016/j.mechatronics.2016.05.014⟩
Mechatronics, Elsevier, 2016, 40, pp.264-269. ⟨10.1016/j.mechatronics.2016.05.014⟩
International audience; Numerous applications require tactile interfaces today. In particular, many customers’ applications such as automotive, Smartphone, tablet PC or touch pad can be concerned by high performances, low voltage haptic interfaces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::166fe95713e0c7c6573282d1785705f2
https://doi.org/10.1016/j.mechatronics.2016.05.014
https://doi.org/10.1016/j.mechatronics.2016.05.014
Autor:
P. Gardes, Warda Benhadjala, Jennifer Guillaume, Gwenael Le Rhun, Christel Dieppedale, Florence Sonnerat, Patrick Poveda, C. Billard, Clémence Bonnard, H. Sibuet, Philippe Renaux
Publikováno v:
International Symposium on Microelectronics. 2015:000256-000261
Integrated metal-insulator-metal (MIM) capacitors using sol-gel PZT doped with lanthanum (La, PLZT), manganese (Mn, PMZT) and niobium (Nb, PNZT) were successfully processed and characterized for tunable applications. Dielectric properties of doped-PZ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff46ce10c291e1c17f903abb70661d6c
https://doi.org/10.4071/isom-2015-wa41
https://doi.org/10.4071/isom-2015-wa41
Autor:
Henri Sibuet, Emmanuel Defay, Sylvain Pelloquin, Gwenael Le Rhun, Emmanuel Nolot, Philippe Renaux, J. Abergel
Publikováno v:
Integrated Ferroelectrics. 157:132-138
PbZr0,52Ti0,48O3 thin films were synthetized by sol-gel techniques on large scale Pt(111)/TiOx/SiO2/Si substrates (200 mm in diameter). The Zr/Ti ratio gradient – that appears through the thickness of the layer with standard processing – can be r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2979f4400bd71f8ac159d1c59152f6ae
https://doi.org/10.1080/10584587.2014.912887
https://doi.org/10.1080/10584587.2014.912887
Autor:
Philippe Renaux, Christel Dieppedale, Fabrice Casset, G. Le Rhun, Skandar Basrour, Emmanuel Defay, Pascal Ancey, M. Gorisse, S. Fanget, Arnaud Devos, Cedrick Chappaz, J S Danel
Publikováno v:
Proceedings
15th international conference on Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime'14)
15th international conference on Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime'14), Apr 2014, Ghent, Belgium. pp.1-4, ⟨10.1109/EuroSimE.2014.6813769⟩
Proceedings of 15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, 2014, Ghent, Belgium. 4 p., ⟨10.1109/EuroSimE.2014.6813769⟩
15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, 2014, Ghent, Belgium. pp.1-4, ⟨10.1109/EuroSimE.2014.6813769⟩
15th international conference on Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime'14)
15th international conference on Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime'14), Apr 2014, Ghent, Belgium. pp.1-4, ⟨10.1109/EuroSimE.2014.6813769⟩
Proceedings of 15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, 2014, Ghent, Belgium. 4 p., ⟨10.1109/EuroSimE.2014.6813769⟩
15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, 2014, Ghent, Belgium. pp.1-4, ⟨10.1109/EuroSimE.2014.6813769⟩
ISBN : 978-1-4799-4791-1; International audience; The tremendous development of tactile interface in many customers' applications such as Smartphone, tablet PC or touch pad leads industrials to study “haptic interfaces” or “touch screen” solu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8733a7239165e681929f80b03863ea51
https://hal.archives-ouvertes.fr/hal-01076436
https://hal.archives-ouvertes.fr/hal-01076436
Autor:
Emmanuel Defay, B. Semail, J S Danel, M. Amberg, Christel Dieppedale, G. Le Rhun, M. Gorisse, S. Fanget, Philippe Renaux, Pascal Ancey, Skandar Basrour, Arnaud Devos, Y. Civet, Cedrick Chappaz, Fabrice Casset
Publikováno v:
Proceedings of 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2013
17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2013
17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2013, 2013, Barcelona, Spain. paper Th3A.003, 2733-2736, ⟨10.1109/Transducers.2013.6627371⟩
17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2013
17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2013, 2013, Barcelona, Spain. paper Th3A.003, 2733-2736, ⟨10.1109/Transducers.2013.6627371⟩
The tremendous development of tactile interface in many customers' applications, such as smartphone, leads industrials to study “haptic interfaces” which allow the user to interact with its environment by the sense of touch. This paper reports on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ebca400672682ae5cc3d5b42ea0395af
https://doi.org/10.1109/transducers.2013.6627371
https://doi.org/10.1109/transducers.2013.6627371
Autor:
A. Suhm, Christel Dieppedale, Pascal Ancey, Emmanuel Defay, J. Abergel, S. Fanget, M. Allain, Philippe Renaux, Dino Faralli, M. Cueff, Fabrice Casset, G. Le Rhun, T. Ricart, Arnaud Devos
Publikováno v:
Proceedings of 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012, Cascais, Portugal. pp.1-4, ⟨10.1109/ESimE.2012.6191704⟩
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012, Cascais, Portugal. pp.1-4, ⟨10.1109/ESimE.2012.6191704⟩
In this paper, we showed the realization and the characterization of a PZT-actuated micro-cantilever. The measurement and the modeling of its resonant frequency allow deducing the cantilever length. Using this value and combining the measurement and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5480f0b411a4e06aa360ad3d48666c63
https://hal.archives-ouvertes.fr/hal-00801130
https://hal.archives-ouvertes.fr/hal-00801130
Autor:
Pierre Chainais, Sergio Nicoletti, Anne Ghis, Bérengère Lebental, Nicolas Chevalier, Eric Delevoye, Jean-Marc Fabbri, Philippe Renaux, Pascale Chenevier
Publikováno v:
Nanotechnology
Nanotechnology, Institute of Physics, 2011, 22 (39), pp.395501. ⟨10.1088/0957-4484/22/39/395501⟩
Nanotechnology, 2011, 22 (39), pp.395501. ⟨10.1088/0957-4484/22/39/395501⟩
Nanotechnology, Institute of Physics, 2011, 22 (39), pp.395501. ⟨10.1088/0957-4484/22/39/395501⟩
Nanotechnology, 2011, 22 (39), pp.395501. ⟨10.1088/0957-4484/22/39/395501⟩
International audience; Structural health monitoring of porous materials such as concrete is becoming a major component in our resource-limited economy, as it conditions durable exploitation of existing facilities. Durability in porous materials depe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6b9c97695f191d0c17b6f1c46a5e0bb0
https://hal.archives-ouvertes.fr/hal-00707637/file/Lebental_Nanotechnology_2011.pdf
https://hal.archives-ouvertes.fr/hal-00707637/file/Lebental_Nanotechnology_2011.pdf
Publikováno v:
Ph.D.Research in Microelectronics and Electronics (PRIME'09)
Ph.D.Research in Microelectronics and Electronics (PRIME'09), Jul 2009, Cork, Ireland. pp.248-251
Ph.D.Research in Microelectronics and Electronics (PRIME'09), Jul 2009, Cork, Ireland. pp.248-251
International audience; This work deals with BAW SMR reliability at high power levels. Experimental methods easy to set up in common RF laboratories are presented and validated. Experimental results concerning frequency shifts versus the dissipated p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3628de47261b7fd7152abf91b156ba7e
https://hal.archives-ouvertes.fr/hal-00492161
https://hal.archives-ouvertes.fr/hal-00492161
Autor:
G. Parat, P. Waltz, Skandar Basrour, R.Y. Fillit, Philippe Renaux, Cedrick Chappaz, D. Mercier, D. Bloch, Nizar Ben Hassine, Brice Ivira
Publikováno v:
Proc. of Joint Meeting of the 23rd European Frequency and Time Forum/IEEE International Frequency Control Symposium
Joint Meeting of the 23rd European Frequency and Time Forum/IEEE International Frequency Control Symposium
Joint Meeting of the 23rd European Frequency and Time Forum/IEEE International Frequency Control Symposium, Apr 2009, Besançon, France. pp.237-240, ⟨10.1109/FREQ.2009.5168176⟩
Joint Meeting of the 23rd European Frequency and Time Forum/IEEE International Frequency Control Symposium
Joint Meeting of the 23rd European Frequency and Time Forum/IEEE International Frequency Control Symposium, Apr 2009, Besançon, France. pp.237-240, ⟨10.1109/FREQ.2009.5168176⟩
ISBN 978-1-4244-3511-1; International audience; This paper intends to provide a contribution for a better understanding of the self-heating effect in BAW SMR by developing a predictive 1D-model. Knowing the power dissipated inside the SMR, the presen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ad7d1e2ed031a6216c825460c4962927
https://hal.archives-ouvertes.fr/hal-00544197
https://hal.archives-ouvertes.fr/hal-00544197
Autor:
P. Waltz, Nizar Ben Hassine, G. Parat, Cedrick Chappaz, Philippe Renaux, Serge Blonkowski, D. Mercier, Skandar Basrour, Pascal Ancey
Publikováno v:
Journal of Applied Physics
Journal of Applied Physics, American Institute of Physics, 2008, 105 (4), pp.044111-044111-10. ⟨10.1063/1.3081977⟩
Journal of Applied Physics, 2008, 105 (4), pp.044111-044111-10. ⟨10.1063/1.3081977⟩
Journal of Applied Physics, American Institute of Physics, 2008, 105 (4), pp.044111-044111-10. ⟨10.1063/1.3081977⟩
Journal of Applied Physics, 2008, 105 (4), pp.044111-044111-10. ⟨10.1063/1.3081977⟩
International audience; The electrical propertiesof polycrystalline aluminum nitride (AlN) films grown by reactive dc magnetron sputtering are investigated in the transient and the steady-state regimes through metal-insulator-metal (MIM) structures w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6c99cdb86fd7e5cc42317f313ac12b5a
https://hal.archives-ouvertes.fr/hal-00379157
https://hal.archives-ouvertes.fr/hal-00379157