Zobrazeno 1 - 10
of 55
pro vyhledávání: '"Philippe Lefaucheux"'
Autor:
Thomas Tillocher, Jack Nos, Gaëlle Antoun, Philippe Lefaucheux, Mohamed Boufnichel, Rémi Dussart
Publikováno v:
Micromachines, Vol 12, Iss 10, p 1143 (2021)
The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer, was developed in 2006 and patented. Like the Bosch process, it consists in repeating cycles
Externí odkaz:
https://doaj.org/article/28115b43a0b44ba999df868931d51b8e
Autor:
Aurélie Girard, Neal Fairley, Rim Ettouri, Remi Dussart, Bertrand Boutaud, Philippe Lefaucheux, Vincent Fernandez, Thomas Tillocher, Christophe Cardinaud
Publikováno v:
Surface and Interface Analysis
Surface and Interface Analysis, Wiley-Blackwell, 2021, pp.110508. ⟨10.1002/sia.7030⟩
Surface and Interface Analysis, Wiley-Blackwell, 2021, pp.110508. ⟨10.1002/sia.7030⟩
International audience; Plasma etching techniques can result in damage and contamination of materials, which, if not removed, can interfere with further processing. Therefore, characterisation of the etched surface is necessary to understand the basi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cdec3c08546f2ddbafb1a960a5edbf82
https://doi.org/10.1002/sia.7030
https://doi.org/10.1002/sia.7030
Autor:
Lamiae Hamraoui, Tinghui Zhang, Angela Crespi, Philippe Lefaucheux, Thomas Tillocher, Mohamed Boufnichel, Rémi Dussart
Publikováno v:
Journal of Vacuum Science & Technology A. 41:032602
Atomic layer etching (ALE) of GaN on silicon substrates has been investigated using fluorine-based chemistry. The ALE process used for this study consists of a modification step using SF6 plasma and a removal step using argon plasma. Two configuratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53416d04300bf29fb7acc4cf1dca13d5
https://doi.org/10.1116/6.0002452
https://doi.org/10.1116/6.0002452
Autor:
Rim Ettouri, Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Jodie Phung, Hadrien Philippe, Rémi Dussart
Publikováno v:
PLATHINIUM (Plasma Thin film International Union Meeting) 2021
PLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
HAL
PLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
HAL
International audience; Titanium-based microelectromechanical systems (MEMS) are attractive candidates for biomedical applications. For such devices, deep reactive ion etching (DRIE) is a key fabrication method that enables very high-aspect-ratio fea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::a1a631b24f5678e535d3e413c3a11156
https://hal.archives-ouvertes.fr/hal-03389062
https://hal.archives-ouvertes.fr/hal-03389062
Autor:
Philippe Lefaucheux, Christian Dussarrat, R. Chanson, Jean-Francois de Marneffe, Thomas Tillocher, Remi Dussart
Publikováno v:
Frontiers of Chemical Science and Engineering. 13:511-516
The integration of porous organo-silicate low-k materials has met a lot of technical challenges. One of the main issues is plasma-induced damage, occurring for all plasma steps involved during interconnects processing. In the present paper, we focus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5c084f06f61a104f7392faba3f73db7
https://doi.org/10.1007/s11705-019-1820-5
https://doi.org/10.1007/s11705-019-1820-5
Autor:
Christophe Sinturel, Philippe Lefaucheux, Mukesh Kulsreshath, Thomas Tillocher, Mohamed Boufnichel, Marylène Vayer, Alexane Vital, Remi Dussart
Publikováno v:
Micro and Nano Engineering, Vol 1, Iss, Pp 42-48 (2018)
Micro and Nano Engineering
Micro and Nano Engineering, Elsevier, 2018, 1, pp.42-48. ⟨10.1016/j.mne.2018.10.007⟩
Micro and Nano Engineering
Micro and Nano Engineering, Elsevier, 2018, 1, pp.42-48. ⟨10.1016/j.mne.2018.10.007⟩
Cryogenic plasma deep-etching for silicon sub-micron structures was studied with the use of modified poly(styrene) (PS) perforated masks obtained from laterally phase separated PS and poly (lactic acid) PLA blend thin films. PS mask was stained by he
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1d824bc62d8901040ba4ba23a789be11
https://doi.org/10.1016/j.mne.2018.10.007
https://doi.org/10.1016/j.mne.2018.10.007
Autor:
Remi Dussart, R. Chanson, Philippe Lefaucheux, J.-F. de Marneffe, Yu. A. Mankelevich, S. Naumov, S. De Gendt, Liping Zhang, Thomas Tillocher
Publikováno v:
Scientific Reports, Vol 8, Iss 1, Pp 1-12 (2018)
Scientific Reports
Scientific Reports, Nature Publishing Group, 2018, 8 (1), ⟨10.1038/s41598-018-20099-5⟩
Scientific Reports
Scientific Reports, Nature Publishing Group, 2018, 8 (1), ⟨10.1038/s41598-018-20099-5⟩
The micro-capillary condensation of a new high boiling point organic reagent (HBPO), is studied in a periodic mesoporous oxide (PMO) with ∼34 % porosity and k-value ∼2.3. At a partial pressure of 3 mT, the onset of micro-capillary condensation oc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e06b7bdc1c07bdac171bc41fe2513621
http://link.springer.com/article/10.1038/s41598-018-20099-5
http://link.springer.com/article/10.1038/s41598-018-20099-5
Autor:
Mohamed Boufnichel, Remi Dussart, Antoun Gaelle, Jack Nos, Philippe Lefaucheux, Thomas Tillocher
Publikováno v:
Micromachines
Volume 12
Issue 10
Micromachines, Vol 12, Iss 1143, p 1143 (2021)
Micromachines, MDPI, 2021, 12 (10), pp.1143. ⟨10.3390/mi12101143⟩
Volume 12
Issue 10
Micromachines, Vol 12, Iss 1143, p 1143 (2021)
Micromachines, MDPI, 2021, 12 (10), pp.1143. ⟨10.3390/mi12101143⟩
The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer, was developed in 2006 and patented. Like the Bosch process, it consists in repeating cycles
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5bbcae398cac39608a9e334413ff2963
https://doi.org/10.3390/mi12101143
https://doi.org/10.3390/mi12101143
Autor:
V Schulz-von der Gathen, Olivier Aubry, Ronan Michaud, Remi Dussart, Arnaud Stolz, Philippe Lefaucheux, Valentin Felix, Sebastian Dzikowski, Lawrence J. Overzet
Publikováno v:
Plasma Sources Science and Technology
Plasma Sources Science and Technology, IOP Publishing, 2018, 27 (2), ⟨10.1088/1361-6595/aaa870⟩
Plasma Sources Science and Technology, IOP Publishing, 2018, 27 (2), ⟨10.1088/1361-6595/aaa870⟩
Microhollow cathode discharges have been produced on silicon platforms using processes usually used for MEMS fabrication. Microreactors consist of 100 or 150 μm-diameter cavities made from Ni and SiO2 film layers deposited on a silicon substrate. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::31bb5c153678a08f42e4c8609e08f401
https://hal.archives-ouvertes.fr/hal-01701973
https://hal.archives-ouvertes.fr/hal-01701973
Autor:
Philippe Lefaucheux, V Schulz-von der Gathen, Ronan Michaud, Goran B. Sretenović, Sylvain Iseni, Remi Dussart
Publikováno v:
Plasma Sources Science and Technology
Plasma Sources Science and Technology, IOP Publishing, 2019, 28 (6), pp.065003. ⟨10.1088/1361-6595/ab1dfb⟩
Plasma Sources Science and Technology, IOP Publishing, 2019, 28 (6), pp.065003. ⟨10.1088/1361-6595/ab1dfb⟩
International audience; The neutral gas temperature (Tg) of a single micro-hollow cathode discharge (MHCD) elaborated on silicon wafer is investigated. The MHCD is continuously powered in DC yielding a plasma in He, Ar and N2 gases close to atmospher
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c8b90ea6598f670cf4001c730ad7e8e4
https://doi.org/10.1088/1361-6595/ab1dfb
https://doi.org/10.1088/1361-6595/ab1dfb