Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Philippe Kertesz"'
Autor:
Bernard Tregon, R. Even, Yves Ousten, Laurent Bechou, Philippe Kertesz, François Marc, Yves Danto
Publikováno v:
Microelectronics Reliability. 37:1787-1790
This paper deals with two techniques for improvement of ultrasonic images interpretation based on image and digital signal processing. The first technique concerns image processing. We propose an analytical model to evaluate the effective Point Sprea
Publikováno v:
IEEE MTT-S International Microwave Symposium Digest, 2005..
This paper describes packages solutions developed to integrate MMICs which operate from 2GHz to 20GHz. These chip scale nonhermetic packages are made up of organic based material and are dedicated to assembly onto organic multilayers. Three solutions
Autor:
Laurent Bechou, I. Bord-Majek, Philippe Kertesz, Yves Ousten, Bruno Levrier, D. Caban-Chastas, J. Mazeau
Publikováno v:
HAL
Embedded passives are becoming increasingly important for the manufacture of highly integrated electronic boards and packages. The need for embedded passives emerges from the growing consumer demand for product miniaturization thus requiring smaller
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d64a04cf3ac6805263c88b2690059952
https://hal.archives-ouvertes.fr/hal-00641070
https://hal.archives-ouvertes.fr/hal-00641070