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pro vyhledávání: '"Philip Nolmans"'
Autor:
Hesheng Lin, Dimitrios Velenis, Philip Nolmans, Xiao Sun, Francky Catthoor, Rudy Lauwereins, Geert Van der Plas, Eric Beyne
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30:661-665
Autor:
Nicolas Pantano, Marian Verhelst, Dimitrios Velenis, Pieter Bex, Eric Beyne, Philip Nolmans, Geert Van der Plas
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Memory bandwidth is the main bottleneck to improve the performance of today's computing systems, and the demand for bandwidth is expected to grow exponentially in the coming years. The development of advanced packaging solutions making use of a silic
Publikováno v:
Solid State Phenomena. 187:223-226
NMP is a commonly used solvent for removing positive photoresist in 3D applications, especially in electroplating and (micro-) bumping. However, the negative photoresists are more and more preferred in these applications. Unfortunately, NMP is ineffi