Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Petuhov I. B."'
Autor:
Petuhov I. B.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 1-2, Pp 49-53 (2021)
To improve the quality of ultrasonic wire and ribbon bonding, the author propose a methodology for stabilizing the bonding force by compensating the rigidity of ultrasonic transducer (UST) mount in the ultrasonic / thermosonic bonding cycle. The auth
Externí odkaz:
https://doaj.org/article/bc3fd14d55d9478aa0c667b01f1458a8
Autor:
Lanin V. L., Petuhov I. B.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 2-3, Pp 48-53 (2014)
The authors consider the processes of obtaining raised density microwelded connections in 3D-integrated microcircuits by the thermosonic microwelding. The processes include the use of the raised frequencies of ultrasound, application of the microinst
Externí odkaz:
https://doaj.org/article/366ab77adf154b98b8796ab3186a40e5
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p572-598, 27p
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p567-571, 5p
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p553-566, 14p
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p520-552, 33p
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p508-519, 12p
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p492-507, 16p
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p463-491, 29p
Publikováno v:
Surface Engineering & Applied Electrochemistry; Jun2024, Vol. 60 Issue 3, p454-462, 9p