Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Peter Z.F. Shi"'
Publikováno v:
Journal of Physics: Conference Series. 34:142-147
In this paper, performance evaluation of miniature heat pipes in LTCC was made by numerical analysis, and the optimum miniature heat pipe design was defined. The effect of the groove depth, width and vapor space on the heat transfer capacity of minia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b29a831dceb9cc461245ee4a5259842
https://doi.org/10.1088/1742-6596/34/1/024
https://doi.org/10.1088/1742-6596/34/1/024
Publikováno v:
Microelectronics Reliability. 44:755-769
This paper describes a thermal design methodology for a 2.5 Gbps optical transmitter that mainly comprises a laser array of 12 VCSELs and a laser driver module. An integrated heat sink design was performed and optimized through modeling and simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51744de3a349f55fffb1378e92212bc3
https://doi.org/10.1016/j.microrel.2004.02.002
https://doi.org/10.1016/j.microrel.2004.02.002
Publikováno v:
Volume 4: Electronics and Photonics.
Light-emitting diode (LED) street lamp has gained its acceptance rapidly in the lighting system as one of choices for low power consumption, high reliability, dimmability, high operation hours, and good color rendering applications. However, as the L
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b00356f0b30da8be7927f09efa2bc783
https://doi.org/10.1115/imece2010-38557
https://doi.org/10.1115/imece2010-38557
Publikováno v:
2007 9th Electronics Packaging Technology Conference.
The potential of SSL (solid-state lighting) is boundless, and SSL is the future of light. However with the heat flux increasing rapidly with high-power LEDs, thermal management is critically important for the light quality and lighting reliability in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77b28c52dc5547cee32054c871951f44
https://doi.org/10.1109/eptc.2007.4469728
https://doi.org/10.1109/eptc.2007.4469728
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
Thermoelectric cooler (TEC) is a solid state heat pump which uses the semiconductor materials, by Peltier effect, to provide instantaneous cooling or heating. It has the advantage of having no moving parts and thus maintenance free. Due to flexibilit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d26f1b34b98adf1786c4e7264842d8b3
https://doi.org/10.1109/eptc.2005.1614508
https://doi.org/10.1109/eptc.2005.1614508
Autor:
Bill Freeman, Vasudivan Sunappan, Hongjin Jiang, Wei Fan, Stephen C. K. Wong, Y.M. Tan, Kai Meng Chua, Peter Z.F. Shi
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
We proposed a methodology for simulation and design of thermoelectric coolers based on the energy balance among the Peltier heat, Joule heat, conduction heat, radiation heat and convection heat and by using the Computational Fluid Dynamics software.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8328bed994d645f4c7b6974e882f47a6
https://doi.org/10.1115/ipack2005-73309
https://doi.org/10.1115/ipack2005-73309