Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Peter Welti"'
Autor:
Aleksandra Clancy, Ayman Hamouda, Ashwini Chandrasekhar, Shyam Pal, Jeff Shu, Christopher Ordonio, Jason Eugene Stephens, Chun Hui Low, Ming He, Prakash Periasamy, Mary Claire Silvestre, Anbu Selvam Km Mahalingam, Peter Welti, Craig Child, Granger Lobb, Ketan Shah
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
10nm M1 local interconnect is using three-color litho-etch-litho-etch-litho-etch (LELELE) integration to enable technology scaling. This paper discusses the challenges to balance the three-color density in critical standard cell scaling, illustrates
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7a2ece826e66bfdf116c6484b2c2ed5
https://doi.org/10.1109/iitc-amc.2016.7507642
https://doi.org/10.1109/iitc-amc.2016.7507642
Autor:
Craig Child, Prakash Periasamy, Ashwini Chandrasekhar, Shyam Pal, Chun Hui Low, Anbu Selvam Km Mahalingam, Ketan Shah, Christopher Ordonio, Peter Welti
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
In advanced technology nodes, the BEOL requires advanced patterning techniques such as triple patterning (LELELE) and side wall image transfer techniques to form metal and via structures with pitches below 50nm. In this paper, we demonstrate metal cr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2de681e559d4c68e72791f7ec32be1a
https://doi.org/10.1109/asmc.2016.7491157
https://doi.org/10.1109/asmc.2016.7491157
