Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Peter Timmermans"'
Publikováno v:
Engineering Fracture Mechanics, 78(6), 877-889. Elsevier
Layer buckling and delamination is a common interfacial failure phenomenon in thin film multi-layer structures that are used in flexible display applications. Typically, the substrate is coated on both sides with a hybrid coating, called a hard coat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f3de374b4a53bd79d850100bf48c43b1
https://doi.org/10.1016/j.engfracmech.2011.01.013
https://doi.org/10.1016/j.engfracmech.2011.01.013
Autor:
Jan Neggers, van der O Olaf Sluis, Jpm Johan Hoefnagels, Mgd Marc Geers, Phm Peter Timmermans
Publikováno v:
Scripta Materialia
Scripta Materialia, Elsevier, 2010, 63 (8), pp.875--878. ⟨10.1016/j.scriptamat.2010.06.041⟩
Scripta Materialia, 63(8), 875-878. Elsevier
Scripta Materialia, Elsevier, 2010, 63 (8), pp.875--878. ⟨10.1016/j.scriptamat.2010.06.041⟩
Scripta Materialia, 63(8), 875-878. Elsevier
International audience; Interface delamination in metal–rubber-type stretchable electronic systems leads to early failure. This paper reports an investigation of metal–rubber interfaces through in situ scanning electron microscopy imaging of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8ce70eec208972b07de56a7a38a677c3
https://doi.org/10.1016/j.scriptamat.2010.06.041
https://doi.org/10.1016/j.scriptamat.2010.06.041
Publikováno v:
Langmuir, 21(17), 7971-7978. American Chemical Society
One of the major issues during soft lithographic processes is that, if the pressing force on the stamp becomes too high, the stamp may erroneously come into contact with the substrate in zones where contact is not intended. This decreases the pattern
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6372730df87318b2f8b8b61a000b6fbc
https://doi.org/10.1021/la050709p
https://doi.org/10.1021/la050709p
Publikováno v:
Journal of Engineering Materials and Technology. 122:177-185
Intrinsic strain softening appears to be the main cause for the occurrence of plastic localization phenomena in deformation of glassy polymers. This is supported by the homogeneous plastic deformation behavior that is observed in polycarbonate sample
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0705b2d7c900892c3a2f9f4cefffed8
https://doi.org/10.1115/1.482784
https://doi.org/10.1115/1.482784
Publikováno v:
Life Sciences. 63:223-234
A novel binding site for angiotensin II has been identified in certain murine tissues. This site, denoted ATm, is distinct from both the AT1 and AT2 sites, as well as the various atypical sites that have been described. The site has a low affinity fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b2ce6dd87dde319b78885f457353a6b7
https://doi.org/10.1016/s0024-3205(98)00263-x
https://doi.org/10.1016/s0024-3205(98)00263-x
Publikováno v:
Topics in Applied Mechanics ISBN: 9789401049269
To describe the constitutive behaviour of a certain class of polymer blends an elasto-perfectly-viscoplastic and creep damageable material characterization is proposed. For a composite of 80% Polystyrene and 20% Ethylene Propylene Diene Monomer rubbe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a041a511f91c0738fdf1174b02cb7230
https://doi.org/10.1007/978-94-011-2090-6_15
https://doi.org/10.1007/978-94-011-2090-6_15
Autor:
Jpm Johan Hoefnagels, Phm Peter Timmermans, Yung-Yu Hsu, van der O Olaf Sluis, Mario Gonzalez
Publikováno v:
Journal of Physics D: Applied Physics, 44(3):034008, 1-11. Institute of Physics
Journal of Physics D: Applied Physics
Journal of Physics D: Applied Physics, IOP Publishing, 2011, 44 (3), pp.34008. ⟨10.1088/0022-3727/44/3/034008⟩
Journal of Physics D: Applied Physics
Journal of Physics D: Applied Physics, IOP Publishing, 2011, 44 (3), pp.34008. ⟨10.1088/0022-3727/44/3/034008⟩
International audience; Stretchable electronics offer increased design freedom of electronic products. Typically, small rigid semiconductor islands are interconnected with thin metal conductor lines on top of, or encapsulated in, a highly compliant s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2f8b77789cc2de2937c1036e2e11612c
https://doi.org/10.1088/0022-3727/44/3/034008
https://doi.org/10.1088/0022-3727/44/3/034008