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Autor:
Peter Basa, Jack Downey, John Barker, Laszlo Makai, Audrey Engelsberg, Arpad Jakab, Jeffrey Wood, Andrew Findlay, Nicholas Pieniazek, J. Byrnes, Peter Rutka, Alok Vaid
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
A novel optical reflectometry solution, capable of measuring planar, blanket thin films on 300mm Si wafers within a self-contained and portable Front Opening Unified Pod (FOUP)-based compact metrology system, the Metrology- FOUP (M-FOUP) System, is i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a83997bb78547be4361bbab50a381bf7
https://doi.org/10.1109/asmc.2019.8791777
https://doi.org/10.1109/asmc.2019.8791777
