Zobrazeno 1 - 10
of 99
pro vyhledávání: '"Peter Ramm"'
Autor:
Dominik Udiljak, Reinhard Pufall, Georg M. Reuther, Jamila Boudaden, Peter Ramm, Gabriele Schrag
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28cfd4a2c0fefbc7493ec68b5baf031c
https://doi.org/10.1109/eurosime54907.2022.9758867
https://doi.org/10.1109/eurosime54907.2022.9758867
Autor:
Alain Lacampagne, J. Boudaden, Umair Gulzar, Colm O'Dwyer, Benoit Charlot, Yan Zhang, Jonas Tilly, Shane Geary, Thierry Gil, Fredrik Sebelius, Colm Glynn, Kafil M. Razeeb, Nadine Azemard, Abhishek Singh Dahiya, Peter Ramm, Jérôme Thireau, Aida Todri-Sanial, Tim Kiessling, Swatchith Lal, Cian O'Murchu
Publikováno v:
Journal of The Electrochemical Society
Journal of The Electrochemical Society, Electrochemical Society, 2020, JES Focus Issue on Sensor Reviews, 167 (3), ⟨10.1149/2.0162003JES⟩
Journal of The Electrochemical Society, 2020, JES Focus Issue on Sensor Reviews, 167 (3), ⟨10.1149/2.0162003JES⟩
Pure TUe
Journal of The Electrochemical Society, Electrochemical Society, 2020, JES Focus Issue on Sensor Reviews, 167 (3), ⟨10.1149/2.0162003JES⟩
Journal of The Electrochemical Society, 2020, JES Focus Issue on Sensor Reviews, 167 (3), ⟨10.1149/2.0162003JES⟩
Pure TUe
Energy Autonomous Wearable Sensors (EAWS) have attracted a large interest due to their potential to provide reliable measurements and continuous bioelectric signals, which help to reduce health risk factors early on, ongoing assessment for disease pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::196edc24f8659c6c27268bdf90d041de
https://hal-lirmm.ccsd.cnrs.fr/lirmm-02387984
https://hal-lirmm.ccsd.cnrs.fr/lirmm-02387984
Publikováno v:
ECS Meeting Abstracts. :628-628
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbfa0162537dbe95b914c6e25447c2d5
https://doi.org/10.1149/ma2021-0212628mtgabs
https://doi.org/10.1149/ma2021-0212628mtgabs
Autor:
Armin Klumpp, Peter Schneider, Andy Heinig, Christof Landesberger, Peter Ramm, Josef Weber, Guenter Elst, Manfred Engelhardt
Publikováno v:
3DIC
Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d624452fc6839fd5cf2c6b171af32fd
https://doi.org/10.1109/3dic48104.2019.9058871
https://doi.org/10.1109/3dic48104.2019.9058871
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:001847-001884
The European 3D heterogeneous integration platform has been established by the consortium of the Integrated Project e-BRAINS [1], where technologies of the following relevant main categories of 3D integration are provided to enable future application
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8b6e2c4a94c36235631e4ef05570223
https://doi.org/10.4071/2015dpc-tha11
https://doi.org/10.4071/2015dpc-tha11
Autor:
Sebastian Hetzler, Stefan Rues, Andreas Zenthöfer, Peter Rammelsberg, Christopher J. Lux, Christoph J. Roser
Publikováno v:
Bioengineering, Vol 11, Iss 4, p 394 (2024)
The efficacy of retainers is a pivotal concern in orthodontic care. This study examined the biomechanical behaviour of retainers, particularly the influence of retainer stiffness and tooth resilience on force transmission and stress distribution. To
Externí odkaz:
https://doaj.org/article/3b73bff6d1a047b5864c07913bd5ba4f
Autor:
Peter Ramm, Ilja Ocket, Adrian M. Ionescu, Amin Enayati, Josef Weber, Armin Klumpp, Mariazel Maqueda Lopez, Wolfgang A. Vitale, Reinhard Merkel, Walter De Raedt, Montserrat Fernandez-Bolanos
Publikováno v:
3DIC
We demonstrate and review the unique fine-pitch high-aspect ratio tungsten-filled through-silicon vias (W-TSVs) technology developed by Fraunhofer EMFT in high-resitivity silicon substrates. The proposed process flow is fully compatible with both CMO
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a52de11f751c45bdc42d1a952b10e0b7
https://doi.org/10.1109/3dic.2016.7970030
https://doi.org/10.1109/3dic.2016.7970030
Autor:
Armin Klumpp, Peter Ramm
Publikováno v:
Handbook of Wafer Bonding
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eab13adc67bb5e3450d40ed10d66f19e
https://doi.org/10.1002/9783527644223.ch17
https://doi.org/10.1002/9783527644223.ch17
Publikováno v:
Handbook of Wafer Bonding
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ddb242c2c9575dffb7efd25a4ef8842
https://doi.org/10.1002/9783527644223.ch15
https://doi.org/10.1002/9783527644223.ch15
Publikováno v:
ECS Meeting Abstracts. :1140-1140
Sensor systems are the key elements of today’s automotive, health care, environmental and Internet-of-Things (IoT) applications. By using MEMS sensors real-world data like physical or electrical parameters in production equipment, gas concentration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d9c439a410b492840cb401e336dd79cf
https://doi.org/10.1149/ma2018-02/33/1140
https://doi.org/10.1149/ma2018-02/33/1140