Zobrazeno 1 - 10
of 87
pro vyhledávání: '"Peter Meuris"'
Publikováno v:
Applied Mathematics and Computation
Modeling of sophisticated applications, such as coupled problems arising from nanoelectronics can lead to quadratic differential algebraic equations (DAEs). The quadratic DAEs may also be parameterized, due to variations in material properties, syste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::281dd704ebffc38cb25e17119cc4691b
https://doi.org/10.1016/j.amc.2017.04.024
https://doi.org/10.1016/j.amc.2017.04.024
Autor:
Herbert De Gersem, Aarnout Wieers, Tomas Kratochvil, Thorben Casper, Tomas Gotthans, David J. Duque Guerra, Ulrich Römer, Peter Meuris, Renaud Gillon, Sebastian Schöps
Publikováno v:
Mathematics in Industry ISBN: 9783030307257
In this chapter, models for the heating in bond wires are presented. First, an analytic model is developed, which allows a fast characterisation of the bond wire properties, e.g., its time to failure. Secondly, a more accurate model using the finite
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7eb8d6890f2528834cfd4c0fd0bf625f
https://doi.org/10.1007/978-3-030-30726-4_3
https://doi.org/10.1007/978-3-030-30726-4_3
Autor:
Piotr Putek, E. Jan W. ter Maten, Roland Pulch, Michael Günther, Wim Schoenmaker, Peter Meuris, Andreas Bartel
Publikováno v:
Mathematics in Industry ISBN: 9783030307257
We address the shape optimization problem of electronic and electric devices under geometrical and material uncertainties. Thereby, we aim at reducing undesirable phenomena of these devices such as hot-spots or torque fluctuations. The underlying min
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6188a38ad028fc7ffe8385fb713bf5c3
https://doi.org/10.1007/978-3-030-30726-4_10
https://doi.org/10.1007/978-3-030-30726-4_10
Autor:
Roland Pulch, Michael Günther, Piotr Putek, E. Jan W. ter Maten, Wim Schoenmaker, Peter Meuris
Publikováno v:
IEEE Transactions on Magnetics. 52:1-4
In this paper, we focus on incorporating a stochastic collocation method (SCM) into a topological shape optimization of a power semiconductor device, including material and geometrical uncertainties. This results in a stochastic direct problem and, i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcc97e538922a93fcdd0f2428394f50e
https://doi.org/10.1109/tmag.2015.2479361
https://doi.org/10.1109/tmag.2015.2479361
Publikováno v:
Scientific Computing in Electrical Engineering ISBN: 9783319755373
Recently, the block-diagonal structured model order reduction method for electro-thermal coupled problems with many inputs (BDSM-ET) was proposed in Banagaaya et al. (Model order reduction for nanoelectronics coupled problems with many inputs. In: Pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8cbc035c349c65d527dc1fb62b73056
https://doi.org/10.1007/978-3-319-75538-0_18
https://doi.org/10.1007/978-3-319-75538-0_18
The models for nanoelectronics coupled problems, such as electro-thermal (ET) coupled problems, are very large in scale. These models often include parameter variability to guarantee quality and yield. The parameter variations can be due to material
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e038c6bc6b0f951260b4b7d85aac548
https://doi.org/10.14293/p2199-8442.1.sop-math.pnc4h0.v1
https://doi.org/10.14293/p2199-8442.1.sop-math.pnc4h0.v1
Publikováno v:
Scientific Computing in Electrical Engineering ISBN: 9783319303987
In this work, we discuss the parametric modeling for the thermodynamic analysis of components of nanoelectronic structures and automatic model order reduction of the consequent parametric models. Given the system matrices at different values of the p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::795e665ded4179b8f0aa5c15874b7510
https://doi.org/10.1007/978-3-319-30399-4_16
https://doi.org/10.1007/978-3-319-30399-4_16
Publikováno v:
Mathematics in Industry ISBN: 9783319234120
This paper presents a new solution method to deal with thermal effects in power designs. The new ingredients are: (1) the treatment of the electric and thermal fields are done fully self-consistent, (2) the dealing with (fragments of) the transistor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20a3da6e5e9b5d0ed5cf2cca4c23eb9b
https://doi.org/10.1007/978-3-319-23413-7_115
https://doi.org/10.1007/978-3-319-23413-7_115
Publikováno v:
DATE
Circuit simulators used in semiconductor industry are based on lumped element models described in form of net lists. In order to be able to incorporate the mutual electromagnetic influence of neighboring elements (e.g. cross talking), one needs refin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0cddee8421e798b1327a167a3464e804
https://doi.org/10.3850/9783981537079_0995
https://doi.org/10.3850/9783981537079_0995
Autor:
Peter Meuris, Michael Günther, Aarnout Wieers, E. Jan W. ter Maten, Roland Pulch, Frederik Deleu, Wim Schoenmaker, Piotr Putek
Publikováno v:
DATE
In this paper we focus on a shape/topology optimization problem of a power MOS transistor under geometrical and material uncertainties to reduce the current density overshoot. This problem, occurring in the automotive industry, yields a stochastic el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30072ae0872291fa85e360c93980bb3d
https://doi.org/10.3850/9783981537079_0998
https://doi.org/10.3850/9783981537079_0998