Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Peter Meszmer"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02cc696d418e9880a47a96c9aa3babb7
https://doi.org/10.1109/eurosime56861.2023.10100829
https://doi.org/10.1109/eurosime56861.2023.10100829
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6efed23402c391087b30a350b85b7123
https://doi.org/10.1109/eurosime54907.2022.9758902
https://doi.org/10.1109/eurosime54907.2022.9758902
Autor:
Bernhard Wunderle, G. Bottger, M. Tavakolibasti, Huseyin Erdogan, Peter Meszmer, A. Seshaditya, Gordon Elger, M. Kettelgerdes
Publikováno v:
Microelectronics Reliability. 141:114871
In the current work, the steps of the development of a Reduced Complexity Model (RCM) of a Light Detection and Ranging (LiDAR) system and the requirements for the preparation of a Digital Twin (DT) from such system are discussed. Preliminary thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::434c00c94256b8b62af3d3c6b4d0c46d
https://doi.org/10.1016/j.microrel.2022.114871
https://doi.org/10.1016/j.microrel.2022.114871
Autor:
N. Johrmann, Bernhard Wunderle, J. Arnold, R. Ecke, M. Tavakolibasti, Uwe Zschenderlein, Sebastian Voigt, Jan Mehner, Peter Meszmer, A. Mohnot
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Thin metal layers, especially those made of copper, are omnipresent in today’s packaging applications as e.g. RDL structures, conductor traces on flexible and stretchable substrates, chip finishes or terminal metallisation, serving electrical, ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b268569a473608d24bf97efa5ce4637d
https://doi.org/10.1109/eurosime48426.2020.9152734
https://doi.org/10.1109/eurosime48426.2020.9152734
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The prediction of high-resolution mechanical stress distributions in electronic chips with a view to improving prognostic and health management in electronics and N/MEMS via artificial intelligence-based processing of measurement data is the focus of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f8e65aaa55da69cf3696cd1c1ff39e4
https://doi.org/10.1109/eurosime48426.2020.9152697
https://doi.org/10.1109/eurosime48426.2020.9152697
Autor:
Mehryar Majd, Przemyslaw Jakub Gromala, Peter Meszmer, Bernhard Wunderle, Alexandru Prisacaru
Publikováno v:
Microelectronics Reliability. 123:114181
The prediction of high-resolution mechanical stress distributions in electronic chips with a view to improving prognostic and health management in electronics and N/MEMS via artificial intelligence-based processing of measurement data is the focus of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a08cf114842708fd03af3e8c24b144fe
https://doi.org/10.1016/j.microrel.2021.114181
https://doi.org/10.1016/j.microrel.2021.114181
Publikováno v:
Microelectronics Reliability. 79:104-110
The development cycle of microelectromechanical systems (MEMS) includes several numerical simulation and optimization iterations. To verify and calibrate the models with experimental data, the non-destructive measurement and imaging of stress distrib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99daa6400f62ec081979b611f03e0541
https://doi.org/10.1016/j.microrel.2017.10.010
https://doi.org/10.1016/j.microrel.2017.10.010
Autor:
Evgeniya Sheremet, Peter Meszmer, Thomas Blaudeck, Susanne Hartmann, Christian Wagner, Bing Ma, Sascha Hermann, Bernhard Wunderle, Stefan E. Schulz, Michael Hietschold, Raul D. Rodriguez, Dietrich R. T. Zahn
The present study covers the nanoanalysis methods for four key material characteristics: electrical and electronic properties, optical, stress and strain, and chemical composition. With the downsizing of the geometrical dimensions of the electronic,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5c79917cce2766d93b0d3b7e44cf4e08
https://publica.fraunhofer.de/handle/publica/258766
https://publica.fraunhofer.de/handle/publica/258766
Autor:
Peter Meszmer, Gianina Schondelmaier, Alexey Shaporin, Dietrich R. T. Zahn, J. Arnold, Karla Hiller, Raul D. Rodriguez, Steffen Hartmann, Jan Mehner, Daniel May, Bernhard Wunderle
Publikováno v:
Microsystem Technologies. 20:1041-1050
In this paper, a novel concept of a thermo-mechanical MEMS actuator using aluminum thin-film heaters on a thermal oxide for electrical insulation is presented. The actuator is part of an universal tensile testing platform for thermo-mechanical materi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc0309df547524eab1b6e4a3a22d27d2
https://doi.org/10.1007/s00542-014-2143-6
https://doi.org/10.1007/s00542-014-2143-6
Autor:
Christian Wagner, Stefan E. Schulz, Florian Fuchs, Thomas Blaudeck, Peter Meszmer, Bernhard Wunderle, Simon Böttger, Sascha Hermann, Jörg Schuster
Publikováno v:
physica status solidi (a). 216:1900584
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e503aebec546a36324c13d66de6daec
https://doi.org/10.1002/pssa.201900584
https://doi.org/10.1002/pssa.201900584