Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Peter Kerepesi"'
Autor:
Mehmet Kaynak, Helmut Kurz, Peter Kerepesi, Sebastian Schulze, Matthias Wietstruck, Mirko Fraschke, Bernhard Rebhan
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
The main challenges for Al-Al wafer bonding are the fast oxidation and the high roughness of the Al surface. This paper describes an optimized Al sputter-deposition process reducing the surface roughness to values below 2 nm. Based on this, a wafer l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0261d113761c4fcbe412ed6175b2b91
https://doi.org/10.1109/ectc.2019.00040
https://doi.org/10.1109/ectc.2019.00040
Autor:
Matthias Wietstruck, Selin Tolunay Wipf, Mehmet Kaynak, Josef Meiler, Peter Kerepesi, C. Wipf, Bernhard Rebhan, Gerald Silberer, Helmut Kurz, Sebastian Schulze
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this work, we demonstrate an Al-Al direct bonding process for advanced wafer-level packaging and heterogeneous integration. The wafer bonding process is performed at 300°C with an alignment accuracy of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0cab508acec36419107130fb35126495
https://doi.org/10.1109/ectc.2019.00147
https://doi.org/10.1109/ectc.2019.00147