Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Peter J. Brofman"'
Autor:
K W Lee, Claudius Feger, Stephen L. Buchwalter, L. J. Matienzo, Michael A. Gaynes, Peter J. Brofman, David L. Questad
Publikováno v:
IBM Journal of Research and Development. 49:663-675
When microelectronic packages fail in accelerated stress testing, it is often because of mechanical stress and/or moisture acting upon interfaces between polymeric adhesives or encapsulants and other package components such as solder interconnects, c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7f3e951dc9abb0af565a018c2bf0bc8
https://doi.org/10.1147/rd.494.0663
https://doi.org/10.1147/rd.494.0663
Autor:
Philip A. March, Susan E. Johnson, Peter J. Brofman, Stephen P. DiBartola, Andrew Hillier, Steven E. Weisbrode, John S. Mattoon
Publikováno v:
Journal of Veterinary Internal Medicine. 18:65-74
The clinical records of 11 dogs with histologically confirmed superficial necrolytic dermatitis (SND) and a history of phenobarbital (PB) administration (SND/PB) were evaluated retrospectively (1995-2002). Historical, clinical, clinicopathologic, ult
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2b5923efc32e15a7b07dcac0ffcf1cf3
https://doi.org/10.1111/j.1939-1676.2004.tb00137.x
https://doi.org/10.1111/j.1939-1676.2004.tb00137.x
Publikováno v:
Journal of Veterinary Internal Medicine. 17:230-234
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e20906d3e2147c923524b6c96a52641
https://doi.org/10.1111/j.1939-1676.2003.tb02439.x
https://doi.org/10.1111/j.1939-1676.2003.tb02439.x
Autor:
Peter J. Brofman, Derek Daily, Yasumitsu Orii, Takashi Nauchi, Kazuya Ishiguro, Paul A. Lauro, Tomoyasu Yoshikawa, Jeffrey D. Gelorme, Ryoichi Suzuki, Mark Harrison Mcleod, Peter J. Sorce, Eric D. Perfecto, Kazushige Toriyama, Akira Takaguchi, Jae-Woong Nah
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In this paper, we will describe a new low cost solder bumping technology for use on wafers. The wafer IMS (injection molded solder) process can form fine pitch solder bumps on wafers, while offering greater solder alloy flexibility. This method is al
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::676c03e3f33638e3d705118b8d50795c
https://doi.org/10.1109/ectc.2014.6897461
https://doi.org/10.1109/ectc.2014.6897461
Autor:
Joseph C. Cremaldi, Noshir S. Pesika, Michael A. Gaynes, Eric P. Lewandowski, Peter J. Brofman
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
The observations of the present study show that underfill properties can vary greatly after the initial cure and that these changes can have a significant effect on adhesion. Temperature studies illustrate that underfill adhesion is a strong function
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68dffe2add7a8fb851fa68363489525d
https://doi.org/10.1109/ectc.2014.6897296
https://doi.org/10.1109/ectc.2014.6897296
Publikováno v:
IBM Journal of Research and Development. 36:921-933
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::823bebb6c5879b5bb82611627a10abb8
https://doi.org/10.1147/rd.365.0921
https://doi.org/10.1147/rd.365.0921
Autor:
P. Palmateer, D. Waldman, J. Kim, J. Corso, Balaram Ghosal, R. Pasco, G. Advocate, S. Cvikevich, Y. Fu, A. Arnold, Peter J. Brofman, S. Kapur, P. Hayunga, D.-Y. Shih
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15:369-377
Three low-stress pin attachment structures were developed for the glass ceramic-copper multilayer ceramic (MLC) packaging technology used in IBM ES 9000 processors. The structures include the multilayer thin-film I/O pads, taper-headed pin and low-st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6982a855ed49c31118604889c2fe1ea
https://doi.org/10.1109/33.148505
https://doi.org/10.1109/33.148505
Autor:
Peter J. Brofman, Jiantao Zheng, Virendra R. Jadhav, Kamal K. Sikka, Michael A. Gaynes, Jamil A. Wakil, Sushumna Iruvanti, Hsichang Liu, Jeffrey Thomas Coffin, Edward John Yarmchuk, Richard Langlois
Publikováno v:
2009 59th Electronic Components and Technology Conference.
A thermal interface material (TIM) is typically a compliant material with high thermal conductivity that is applied between a heat-generating chip and a heat spreader in an electronic package. For a high-conductivity polymeric TIM, the adhesion stren
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d504aeef718433d8625d72ff5bb376d4
https://doi.org/10.1109/ectc.2009.5074056
https://doi.org/10.1109/ectc.2009.5074056
Autor:
Donald E. Thrall, Peter J. Brofman
Publikováno v:
Veterinary radiologyultrasound : the official journal of the American College of Veterinary Radiology and the International Veterinary Radiology Association. 47(4)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4bc90c2ed990ee7fbd83f48681b72184
https://pubmed.ncbi.nlm.nih.gov/16863049
https://pubmed.ncbi.nlm.nih.gov/16863049
Publikováno v:
Journal of veterinary internal medicine. 17(2)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::c6b3fe9e27ee9b66652a322b3a9e9410
https://pubmed.ncbi.nlm.nih.gov/12683626
https://pubmed.ncbi.nlm.nih.gov/12683626