Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Peter Hanaway"'
Autor:
Peter Hanaway, Carolyn Guidarelli, Peter G. Jacobs, J.R. Condon, Uma Rajhbeharrysingh, Joseph Leitschuh, Clara Mosquera-Lopez, Kerri M. Winters-Stone
Publikováno v:
EMBC
In this paper, we describe a novel portable test platform that can be used to test peripheral neuropathy either within a clinic or at home. The system, called the PeriVib, is comprised of (1) a small, custom vibration motor designed to apply a vibrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d14bc8b24d731e3593a878244ab4e98f
https://doi.org/10.1109/embc.2018.8513100
https://doi.org/10.1109/embc.2018.8513100
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002199-002225
3D-TSV stacking with non-reworkable bonding processes implies known-good die screening with high test coverage to be economical.Depending upon the stack architecture, the need to contact TSVs directly or TSV bonding pads during wafer test ranges from
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5162986bf7c7f1e735e54502d1e940c
https://doi.org/10.4071/2011dpc-tha16
https://doi.org/10.4071/2011dpc-tha16
Autor:
Reed Gleason, Marc Van Dievel, Peter Hanaway, Bruno Knuts, Erik Jan Marinissen, T. Daenen, Kenneth R. Smith, Eric W. Strid, Mike Jolley, Luc H. Dupas
Publikováno v:
ITC
Practical silicon stacking requires pre-tested dies, but contact probing of TSV interconnects requires much higher density, lower probing forces, and lower cost per pin than conventional probe cards have achieved. This paper examines a cost-effective
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::429d3d41cdbfd848cee1b32e42cf5cd8
https://doi.org/10.1109/test.2011.6139180
https://doi.org/10.1109/test.2011.6139180
Publikováno v:
2008 IEEE MTT-S International Microwave Symposium Digest.
This paper presents an integrated broadband balun probe for differential circuit measurements. The balun consists of the two broadside coupled coplanar strips with a finite ground plane. A new analysis method for the Marchand balun is developed for o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ecde1544eed7f3d5a3b21646d56afbc0
https://doi.org/10.1109/mwsym.2008.4633331
https://doi.org/10.1109/mwsym.2008.4633331