Zobrazeno 1 - 10
of 232
pro vyhledávání: '"Peter Enoksson"'
Autor:
Sadia Farjana, Esperanza Alfonso, Per Lundgren, Vessen Vassilev, Peter Enoksson, Ashraf Uz Zaman
Publikováno v:
IEEE Access, Vol 11, Pp 43630-43638 (2023)
This article presents the first use of a multilayer dry film photoresist to fabricate a slot array antenna by micromachining. The proposed fabrication process demonstrates a straightforward and fast method of realizing antenna structures and delicate
Externí odkaz:
https://doaj.org/article/0d2188d518cc4301b0490895d7136f9a
Publikováno v:
IEEE Access, Vol 10, Pp 27432-27439 (2022)
A micromachined ridge gap waveguide power divider operating at 220–325 GHz is presented. The device is fabricated by SUEX dry film photoresist. Dry film photoresist can be used to obtain geometrical features with high accuracy using a robust fabric
Externí odkaz:
https://doaj.org/article/de8c7a19f1ce47dd936f51a48e48d25a
Autor:
Agin Vyas, Kejian Wang, Alec Anderson, Andres Velasco, Ruben Van den Eeckhoudt, Mohammad Mazharul Haque, Qi Li, Anderson Smith, Per Lundgren, Peter Enoksson
Publikováno v:
ACS Omega, Vol 5, Iss 10, Pp 5219-5228 (2020)
Externí odkaz:
https://doaj.org/article/31965502e23f41e78f235eaf8e7d65a0
Publikováno v:
Micromachines, Vol 12, Iss 3, p 260 (2021)
This paper presents a novel fabrication method based on dry film photoresists to realize waveguides and waveguide-based passive components operating at the millimeter-wave frequency (30–300 GHz). We demonstrate that the proposed fabrication method
Externí odkaz:
https://doaj.org/article/a626e79159574d34adacb463d0ec528b
Autor:
A. D. Smith, Qi Li, Agin Vyas, Mohammad Mazharul Haque, Kejian Wang, Andres Velasco, Xiaoyan Zhang, Shameel Thurakkal, Arne Quellmalz, Frank Niklaus, Kristinn Gylfason, Per Lundgren, Peter Enoksson
Publikováno v:
Sensors, Vol 19, Iss 19, p 4231 (2019)
There is an urgent need to fulfill future energy demands for micro and nanoelectronics. This work outlines a number of important design features for carbon-based microsupercapacitors, which enhance both their performance and integration potential and
Externí odkaz:
https://doaj.org/article/463ac1ee80684d2489a7d5de531aef9f
Autor:
Agin Vyas, Henrik Staaf, Cristina Rusu, Thorbjörn Ebefors, Jessica Liljeholm, Anderson D. Smith, Per Lundgren, Peter Enoksson
Publikováno v:
Micromachines, Vol 9, Iss 5, p 252 (2018)
This paper presents a demonstration of the feasibility of fabricating micro-cantilever harvesters with extended stress distribution and enhanced bandwidth by exploiting an M-shaped two-degrees-of-freedom design. The measured mechanical response of th
Externí odkaz:
https://doaj.org/article/2d07624cbbdc42ae8eb6a6d0eb9dc6b3
Autor:
Amin M Saleem, Sareh Shafiee, Theodora Krasia-Christoforou, Ioanna Savva, Gert Göransson, Vincent Desmaris, Peter Enoksson
Publikováno v:
Science and Technology of Advanced Materials, Vol 16, Iss 1 (2015)
We describe a fast and cost-effective process for the growth of carbon nanofibers (CNFs) at a temperature compatible with complementary metal oxide semiconductor technology, using highly stable polymer–Pd nanohybrid colloidal solutions of palladium
Externí odkaz:
https://doaj.org/article/930f0d0511024aae9ac0a7d4f68eae93
Autor:
Peter Enoksson, Mohammadamir Ghaderi, Ashraf Uz Zaman, Sadia Farjana, Per Lundgren, Sofia Rahiminejad
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2012-2021
This paper presents a novel microfabrication technique to manufacture gap waveguide components operating at sub-millimeter wave (sub-mmWave) frequency range. The conventional metal waveguide component manufacturing has a low resolution and low throug
Autor:
Sadia Farjana, Ashraf Uz Zaman, Yinggang Li, Jonas Hansson, Sofia Rahiminejad, Thomas Emanuelsson, Per Lundgren, Mohammadamir Ghaderi, Sjoerd Haasl, Thomas Eriksson, Peter Enoksson
Publikováno v:
Journal of Infrared, Millimeter, and Terahertz Waves. 42:893-914
This paper presents a novel micromachining process to fabricate a 140 GHz planar antenna based on gap waveguide technology to be used in the next-generation backhauling links. The 140 GHz planar array antenna consists of three layers, all of which ha