Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Peter Chua Thin Wei"'
Publikováno v:
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Power device that require Al wire to carry large currents are widely used in for automotive electronics. Al wire bonding is one of key process for these products. Al wire deformation thickness should be a challenge for Al wedge bonding. As the wedge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f7143a11e618c84e4ef976657cd3227
https://doi.org/10.1109/icept47577.2019.245791
https://doi.org/10.1109/icept47577.2019.245791
Autor:
Peter Chua Thin Wei, Ng Kim Choo, Curt Lin, Kuyt Ku, Tang Chih-yi, Foo Loke Sheng, K. A. Serrels
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
Scan design, being part of the most commonly practiced form of Design for Testability (DFT) has been developed to enable software based diagnosis for scan chain failures. Tessent Diagnosis helps to narrow down the reported failures to a suspected fai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::441e793d3cec17ed23fedc410865a88a
https://doi.org/10.1109/ipfa47161.2019.8984846
https://doi.org/10.1109/ipfa47161.2019.8984846