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pro vyhledávání: '"Per Anker Hassel"'
Autor:
Henrik Hemmen, Per Anker Hassel, Phillip Mayhew, Sørvik Linn Cecilie, Marie-Audrey Marguerite Adrienne Raux
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
We present an innovative strategy to increase the through-plane thermal conductivity of TIM pads. In silicone matrices using several types of ceramic fillers, we demonstrate significant improvement in through-plane thermal conductivity. CondAlign’s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9da260f9cb80dc517c9bccf837b1b9a2
https://doi.org/10.1109/itherm45881.2020.9190254
https://doi.org/10.1109/itherm45881.2020.9190254
