Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Pengrong Lin"'
Autor:
Xuefeng Wu, Zhuangzhuang Hou, Xiaochen Xie, Pengrong Lin, Yongjun Huo, Yong Wang, Xiuchen Zhao
Publikováno v:
Journal of Materials Research and Technology, Vol 31, Iss , Pp 3226-3237 (2024)
Sn–Bi based solders are used in electronic packaging for interconnection processes. However, the rate of research on the comprehensive performance of solders is difficult to match the rapid development of advanced manufacturing of integrated circui
Externí odkaz:
https://doaj.org/article/095b48111e8149da8e7c1b9afee69734
Publikováno v:
Journal of Materials Research and Technology, Vol 29, Iss , Pp 5034-5047 (2024)
The rapid development of space exploration technology was intensifying the desire for lead-free solders with high performance and reliability under extreme temperature environments. In this study, the influence of TiO2 nanoparticle addition on the mi
Externí odkaz:
https://doaj.org/article/3c00fc1a0a694bc39cfcdd57da3a21da
Autor:
Xuefeng Wu, Zhuangzhuang Hou, Xiaochen Xie, Pengrong Lin, Yongjun Huo, Yong Wang, Xiuchen Zhao
Publikováno v:
Journal of Materials Research and Technology, Vol 26, Iss , Pp 1382-1396 (2023)
Severe atomic migration occurs in the solder under the effect of multi-physics field coupling, leading to serious reliability problems. Under the influence of multi-physics field coupling, severe atomic migration occurs in solder, resulting in signif
Externí odkaz:
https://doaj.org/article/21c61c269ded4ecfa46a8ce9758ac70e
Publikováno v:
Frontiers in Materials, Vol 10 (2023)
The fabrication of silver joints was done using the pressureless sintering technology to suit the demand of high-reliability schottky barrier diodes (SBD). Porosity of 10.6% and shear strength of 39.6 MPa were reached under the optimized parameters o
Externí odkaz:
https://doaj.org/article/b74f6baafc8d43c18495cc60ca473d13
Autor:
Zhibo Qu, Yilong Hao, Changhao Chen, Yong Wang, Shimeng Xu, Shuyuan Shi, Pengrong Lin, Xiaochen Xie
Publikováno v:
Materials, Vol 17, Iss 3, p 724 (2024)
PbSn solders are used in semiconductor devices for aerospace or military purposes with high levels of reliability requirements. Microalloying has been widely adopted to improve the reliability for Pb-free solders, but its application in PbSn solders
Externí odkaz:
https://doaj.org/article/de7aa4024f3e4470b9f76a61132eaa1c
Publikováno v:
Man-Machine-Environment System Engineering ISBN: 9789811947858
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc4e6560d6025846b9c6fdcf1ddc7da5
https://doi.org/10.1007/978-981-19-4786-5_100
https://doi.org/10.1007/978-981-19-4786-5_100
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Autor:
Mengke Tian, Hengliang Zhu, Yong Wang, Yimao Cai, Feng Liu, Pengrong Lin, Yingzhuo Huang, Xiaochen Xie
Publikováno v:
Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering ISBN: 9783031243851
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48ef6e2def68289bf035ac75a2ebf883
https://doi.org/10.1007/978-3-031-24386-8_26
https://doi.org/10.1007/978-3-031-24386-8_26
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Publikováno v:
Journal of Physics: Conference Series. 2383:012093
A novel packaging designing for high density and high voltage power module, namely TPak was proposed. It uses flip-chip welding technology and through-hole technology to avoid the parasitic parameters introduced by wire bonding in traditional electri