Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Peng, Zeya"'
Publikováno v:
2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE).
Machine learning is nowadays one of the most efficient and popular tool and theory which has influenced many of the engineering fields. The traditional failure analysis is also based on statistical learning and reliability data, these methods can be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::966e668b41e813be1adc7be2b7f5d655
https://doi.org/10.1109/qr2mse46217.2019.9021177
https://doi.org/10.1109/qr2mse46217.2019.9021177
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
Nowadays, with the products and systems becomes more complex, it will be more difficulty to process the failure analysis in the dependability. Besides we can see the great progress in the field of machine learning, and the joint applications of machi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c1cb22fe4d75f8de36db0add54c8775
https://doi.org/10.1109/ipfa47161.2019.8984840
https://doi.org/10.1109/ipfa47161.2019.8984840
Publikováno v:
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
The chip solder layer of power semiconductor devices carries the mechanical, thermal and electrical loads in the working state of devices. With the increase of packaging density and power density, the reliability requirement of solder layer is increa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1e8496c95d71fe98072956cc8eb1a63
https://doi.org/10.1109/ipfa.2018.8452578
https://doi.org/10.1109/ipfa.2018.8452578
Akademický článek
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Publikováno v:
2014 15th International Conference on Electronic Packaging Technology; 2014, p1194-1197, 4p
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2015, p231-233, 3p
Publikováno v:
2013 International Conference on Quality, Reliability, Risk, Maintenance & Safety Engineering (QR2MSE); 2013, p867-869, 3p