Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Peilun Yao"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08f1c0185eb5a8bc9cc48e77e58230a7
https://doi.org/10.1109/eurosime56861.2023.10100811
https://doi.org/10.1109/eurosime56861.2023.10100811
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3b9774398d883bc56ab52ca1b217689
https://doi.org/10.1109/icept56209.2022.9873400
https://doi.org/10.1109/icept56209.2022.9873400
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bb9cb71925cbabc1374d9e902f1a923
https://doi.org/10.1109/ectc51906.2022.00287
https://doi.org/10.1109/ectc51906.2022.00287
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Driven by the demand of artificial intelligent, high-performance computing, electric vehicle and smart city, semiconductor industry is building high performance and high integrated systems. To increase the energy efficiency of these complicated syste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9e8da0cf926fc4608b8c67e9298197e
https://doi.org/10.1109/icept52650.2021.9568235
https://doi.org/10.1109/icept52650.2021.9568235
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Delamination and solder crack are key concerns in power package, requiring significant attention by engineers during design and process development phases to ensure lowest risk as possible. At same time, more strict requirement is addressed by custom
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d6560c51781fe60cf5bc813e524bb9a
https://doi.org/10.1109/eurosime52062.2021.9410850
https://doi.org/10.1109/eurosime52062.2021.9410850
Publikováno v:
Journal of Aerospace Engineering. 33
The wing leading edge is susceptible to birdstrike, so various antibirdstrike schemes are proposed to ensure that the wing leading edge satisfies the requirements of airworthiness regulatio...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7e1134902c467250cecd785336513ee
https://doi.org/10.1061/(asce)as.1943-5525.0001120
https://doi.org/10.1061/(asce)as.1943-5525.0001120
Publikováno v:
Chemical Engineering Journal. 434:134684
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1857220a02daa558344f3c9eb2512a0
https://doi.org/10.1016/j.cej.2022.134684
https://doi.org/10.1016/j.cej.2022.134684
Publikováno v:
Latin American Journal of Solids and Structures v.16 n.1 2019
Latin American journal of solids and structures
Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM)
instacron:ABCM
Latin American journal of solids and structures
Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM)
instacron:ABCM
The wing leading edge is one of the aircraft structures which are vulnerable to birdstrike. Therefore, Federal Aviation Regulation has clear requirements of anti-birdstrike performance for wing leading edge. However, the impact location is not specif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1411c39910d4e5e3b1ee2a0919bd5f36
https://doi.org/10.1590/1679-78255352
https://doi.org/10.1590/1679-78255352
Autor:
Zeliang Yu1 yuzeliang715@qq.com, Pu Xue1 p.xue@nwpu.edu.cn, Peilun Yao1 ypl04@qq.com, Zahran, M. S.2 m.s.zahran@mtc.edu.eg
Publikováno v:
Latin American Journal of Solids & Structures. 2019, Vol. 16 Issue 1, p1-17. 17p.