Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Peiching Ling"'
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
The LED industry is extremely price sensitive to manufacturing cost. The challenge is to produce modules (or the light engines) without compromising reliability. The present approach is to work within the standard assembly flow structure and focus on
Publikováno v:
Journal of Applied Physics. 71:3225-3230
The quality of epitaxial silicon grown on regions exposed to plasma etching using He, CHF3, and CF4 etching gases has been studied. Plasma‐etch‐induced surface damage leads to defects in the epilayers. Dislocation loops and precipitates at the ep
Publikováno v:
Journal of Applied Physics. 70:685-692
The low‐temperature epitaxial growth of Si under conditions in which no nucleation occurs on SiO2 (selective growth) results in interesting new surface morphology. For substrates free of nonvolatile surface contaminants, specular defect‐free film
Publikováno v:
IEEE Transactions on Magnetics. 34:1567-1569
The effect of carbon and chromium diffusion on CoCrTa thin-film media was studied. RBS (Rutherford backscattering) data and TEM (transmission electron microscopy) micrographs indicate that the CoCr/sub 14/Ta/sub 6/ film has a higher film density than
Publikováno v:
1998 International Conference on Ion Implantation Technology. Proceedings (Cat. No.98EX144).
We present a new method for making shallow p-type junctions in silicon by molecular ion implantation. Unlike current molecular ion implantation methods which use BF/sub 2/ molecules, this new method uses BSi/sub x/, where the silicon is completely mi
Autor:
Jianyue Jin, Peiching Ling, Wei-Kan Chu, Lin Shao, Jiarui Liu, Xinming Lu, Quark Y. Chen, Xuemei Wang
Publikováno v:
AIP Conference Proceedings.
A two-step annealing was performed to study the diffusion of B in the GeB- cluster ion implanted Si. Samples implanted with 15-keV, 1×1015/cm2 GeB- ion cluster were rapid thermal annealed in dry N2 at (i) 1000 °C/10sec (one-step annealing), (ii) 55
Publikováno v:
AIP Conference Proceedings.
Ion implantation has been a traditional and well-developed technique for junction formation in semiconductor devices for more than 30 years. However, now a big challenge to this technique is the high implant current and throughput at very low energy
Publikováno v:
Applied Physics Letters. 60:1232-1234
Low‐temperature epitaxial growth of Si using a dichlorosilane‐hydrogen mixture in a hot‐wall reactor has been studied with respect to in situ predeposition oxide removal. With BF2+ or F+ ion implantation prior to the final substrate cleaning st
Autor:
Irene Rusakova, Xinming Lu, Peiching Ling, Qinmian Li, Wei-Kan Chu, Lin Shao, Jianyue Jin, Quark Y. Chen, Jiarui Liu
Publikováno v:
MRS Proceedings. 610
GeB− Cluster ions have been used to effectively produce 0.65-2keV boron for low energy ion implantation. We have generated the GeB− cluster ions using the SNICS ion source (source of negative ion by cesium sputtering). Shallow junctions have been
Publikováno v:
MRS Proceedings. 220
Low-temperature selective epitaxial growth (SEG) of silicon using a dichlorosilane-hydrogen mixture in an LPCVD hot-wall reactor has been discussed with respect to the wafer preparation and the deposition cycle. The surface morphology and the quality