Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Pei-Chieh Hsiao"'
Publikováno v:
Solar Energy. 255:60-70
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb7e5099ae4571849fb338fee32f1620
https://doi.org/10.1016/j.solener.2023.03.020
https://doi.org/10.1016/j.solener.2023.03.020
Autor:
Pei-Chieh Hsiao, Alison Lennon, Xiaowei Shen, Ning Song, Mengdi Liu, Zhimeng Wang, Alex Stokes, Benjamin Phua
Publikováno v:
Progress in Photovoltaics: Research and Applications. 29:1020-1033
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6fb67349d194dcc06624a20ea30fa99
https://doi.org/10.1002/pip.3425
https://doi.org/10.1002/pip.3425
Publikováno v:
Solar Energy Materials and Solar Cells. 252:112166
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31d9ca888904fec4952aefcbe2a9ed4a
https://doi.org/10.1016/j.solmat.2022.112166
https://doi.org/10.1016/j.solmat.2022.112166
Publikováno v:
Silicon Solar Cell Metallization and Module Technology ISBN: 9781839531552
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f45dd4de8a1ebff6de6265670188e11
https://doi.org/10.1049/pbpo174e_ch11
https://doi.org/10.1049/pbpo174e_ch11
Publikováno v:
Solar Energy. 178:61-68
Busbar pull tests are the generally accepted method of measuring metal-silicon adhesion for silicon solar cells. However, this method cannot be used to measure metal finger adhesion and consequently cannot be used for cells being interconnected with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20d53baeca4017f07c1cfb9df06e3cc2
https://doi.org/10.1016/j.solener.2018.12.004
https://doi.org/10.1016/j.solener.2018.12.004
Publikováno v:
Solar Energy Materials and Solar Cells. 240:111638
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7aaeec58acca1ffbd1147b89fd7c4ed6
https://doi.org/10.1016/j.solmat.2022.111638
https://doi.org/10.1016/j.solmat.2022.111638
Autor:
Ned Ekins-Daukes, Ning Song, Pei-Chieh Hsiao, Alison Lennon, Anastasia Soeriyadi, Udo Römer, Mengdi Liu
Publikováno v:
2020 47th IEEE Photovoltaic Specialists Conference (PVSC).
Copper contacts on GaAs are gaining increasing attention for low-cost high-efficiency solar cell devices. Cu/Ge/Pd and Cu/Pt/Ti/Pt contacts have been reported to achieve low specific contact resistivities in the range of $10_{-5}\ \mathrm{\Omega} \te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0784951d70ea4f82993c47e021af4fe1
https://doi.org/10.1109/pvsc45281.2020.9300525
https://doi.org/10.1109/pvsc45281.2020.9300525
Autor:
Alison Lennon, Xueling Zhang, Pei-Chieh Hsiao, Zhongtian Li, Angus Gentle, Udo Römer, Pierre J. Verlinden, Sean Lim, Bin Gong, Ning Song
Publikováno v:
IEEE Journal of Photovoltaics. 8:916-922
© 2011-2012 IEEE. Interdigitated back-contact (IBC) silicon (Si) solar cells are attracting increased attention due to the potential of higher efficiency that comes from eliminating front-surface shading. However, as sources of recombination loss co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fca6fd74db614929cb779a249ffa1ff2
https://doi.org/10.1109/jphotov.2018.2825465
https://doi.org/10.1109/jphotov.2018.2825465
Publikováno v:
Journal of Analytical Atomic Spectrometry. 33:422-430
The use of laser ablation inductively-coupled plasma mass spectrometry (LA-ICP-MS) is introduced for the analysis of substrate contamination from plated metal contacts on silicon solar cells. Solar cells with plated Ni/Cu/Ag contacts were heat treate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8fcd38501430d296f68609efc8b1410
https://doi.org/10.1039/c7ja00358g
https://doi.org/10.1039/c7ja00358g
Publikováno v:
Solar Energy Materials and Solar Cells. 174:225-232
In this study, silicon solar cells with copper-plated front side metallisation were exposed to long-term reliability thermal stress conditions and the material integrity of the plated contacts after stress testing was investigated using imaging and e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ef5243efae3c93df0cf568e2f1a62a5
https://doi.org/10.1016/j.solmat.2017.09.005
https://doi.org/10.1016/j.solmat.2017.09.005