Zobrazeno 1 - 10
of 100
pro vyhledávání: '"Pei Yang Yan"'
Publikováno v:
Yan, Pei-Yang; Zhang, Guojing; Gullikson, Eric, M.; Goldberg, Kenneth, A.; & Benk, Markus, P.(2017). Understanding EUV mask blank surface roughness induced LWR and associated roughness requirement:. Proc. SPIE, 9422. Lawrence Berkeley National Laboratory: Lawrence Berkeley National Laboratory. Retrieved from: http://www.escholarship.org/uc/item/0jm1n133
Extreme ultraviolet lithography (EUVL) mask multi-layer (ML) blank surface roughness specification historically comes from blank defect inspection tool requirement. Later, new concerns on ML surface roughness induced wafer pattern line width roughnes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cada186e5db1a74512ccb98a1e26bed2
http://www.escholarship.org/uc/item/0jm1n133
http://www.escholarship.org/uc/item/0jm1n133
Autor:
Dabrina D. Dutcher, Christof Asbach, Se-Jin Yook, Jung Hyeun Kim, Heinz Fissan, David Y.H. Pui, Pei-Yang Yan
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 20:578-584
Extreme ultraviolet lithography (EUVL) is considered the next generation lithography to produce 32-nm feature-size or smaller. The challenge is that conventional pellicles are unavailable for protecting the EUVL masks against contaminant particles, b
Autor:
Christof Asbach, Se-Jin Yook, Thomas Engelke, David Y.H. Pui, Jung Hyeun Kim, Heinz Fissan, T. van der Zwaag, Pei-Yang Yan
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 20:176-186
In extreme ultraviolet lithography (EUVL), conventional pellicles are unavailable for protecting the EUVL masks, since they highly absorb the EUV radiation. One of the serious challenges is therefore to prevent particulate contamination of the EUVL m
Autor:
Jing Wang, Christof Asbach, Jung Hyeun Kim, Heinz Fissan, Se-Jin Yook, Pei Yang Yan, David Y.H. Pui
Publikováno v:
Journal of Aerosol Science. 38:211-227
Extreme ultraviolet lithography (EUVL) is considered as the next generation lithography for 32-nm-node or smaller in semiconductor manufacturing. One of the challenges is to protect the EUVL masks against particle contamination, due to the unavailabi
Autor:
Pei Yang Yan, Kevin J. Orvek, David Y.H. Pui, A. Ramamoorthy, Christof Asbach, Se-Jin Yook, Jung Hyeun Kim, Heinz Fissan
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 23:1319-1324
This article presents a study of particle formation during vacuum pump down and methods that can be incorporated to protect critical surfaces (like semiconductor wafers or masks) from those particles. Particle formation during pump down was reexamine
Publikováno v:
SPIE Proceedings.
Evaluation of lithography process or stepper involves very large quantity of CD measurements and measurement time. In this paper, we report on an application of Scatterometry based metrology for evaluation of EUV photomask lithography. Measurements w
Autor:
Pei-Yang Yan, 顏珮仰
101
Along with the technological development of medicine, mankind has placed greater attention on diet and regimen as well as health care so the life span of man-kind has gradually been elongated. In addition, the dramatic decrease of birth-rate
Along with the technological development of medicine, mankind has placed greater attention on diet and regimen as well as health care so the life span of man-kind has gradually been elongated. In addition, the dramatic decrease of birth-rate
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/62421177182843395516
Publikováno v:
SPIE Proceedings.
Extreme Ultraviolet Lithography (EUVL) embedded phase shift mask (EPSM) can further extend lithography resolution limit and provide better pattern fidelity as compared to that of EUVL binary mask for 16nm node technology and beyond generations. In ou
Publikováno v:
SPIE Proceedings.
For Extreme Ultra-violet Lithography (EUVL) targeting at 11nm and beyond design rules, the minimum printable EUVL multilayer (ML) mask defect size can be as small as 20-25nm. As a result, the defect-free EUVL ML mask blank fabrication remains the top
Publikováno v:
SPIE Proceedings.
Extreme UV lithography or EUVL is still the primary candidate to allow scaling below the 22 nm technological node. Three major engineering challenges need to be simultaneously solved for a smooth introduction of EUVL into high volume manufacturing: s