Zobrazeno 1 - 10
of 44
pro vyhledávání: '"Pei Tzu Lee"'
Publikováno v:
Journal of Materials Research and Technology, Vol 19, Iss , Pp 3828-3841 (2022)
Silver (Ag) sintering is widely adopted as a die attach method for power electronics packaging. However, oxidation, massive grain growth, and increasing porous structure occur in sintered Ag joints at high temperatures, resulting in decreasing mechan
Externí odkaz:
https://doaj.org/article/271ba08dba8d40179d1620b1bd9d3451
Publikováno v:
Journal of Materials Research and Technology, Vol 24, Iss , Pp 3889-3900 (2023)
The electromigration reliability of Au/Pd(P)/Ni(P) surface finish in micro joints was investigated in this study. We found that the reaction of Pd(P) with molten Sn would yield a noticeable amount of (Pd,Ni)Sn4 intermetallic compound (IMC) scattering
Externí odkaz:
https://doaj.org/article/b91309b9f1c84ff5a66d80d6528b96c3
Autor:
Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Yu-Hsuan Huang, Ching-Yu Chiang, Ching-Shun Ku, C.R. Kao, Cheng-En Ho
Publikováno v:
Journal of Materials Research and Technology, Vol 13, Iss , Pp 1316-1322 (2021)
The allotropic phase transformation of Cu6Sn5 from a hexagonal (η) to monoclinic (η′) structure at 186 °C is scientifically interesting and technologically important. As the η′ lattice is crystallographically pseudosymmetrical with η, the id
Externí odkaz:
https://doaj.org/article/742008b6a0a4465a8fa6a9c5d6dddcb3
Publikováno v:
Materials & Design, Vol 206, Iss , Pp 109830- (2021)
The fabrication of Cu pillars has recently attracted much attention from the microelectronic/communication industry because pillars can act as thermal dissipation devices and electrical interconnections among different packaging levels, providing eff
Externí odkaz:
https://doaj.org/article/532511c535894bb8937d23424f91f920
Autor:
Chien-Ya Hsu, Yu-Shan Chueh, Ming-Ling Kuo, Pei-Tzu Lee, Hsiu-Shan Hsiao, Jing-Long Huang, Syh-Jae Lin
Publikováno v:
PLoS ONE, Vol 16, Iss 12, p e0261727 (2021)
CD1d-restricted invariant natural killer T cells (iNKT cells) may play an important role in the pathogenesis of systemic lupus erythematosus (SLE). Interleukin (IL)-15 is a pro-inflammatory cytokine which is over-expressed in SLE patients. In the pre
Externí odkaz:
https://doaj.org/article/67fe5ccd8d744be99972a68055b8df0e
Autor:
Syh-Jae Lin, Ming-Ling Kuo, Hsiu-Shan Hsiao, Pei-Tzu Lee, Wen-I Lee, Ji-Yih Chen, Jing-Long Huang
Publikováno v:
Mediators of Inflammation, Vol 2019 (2019)
Natural killer cells and NKT-like cells are the first line immune defense against tumor and virus infection. Deficient NK and NKT-like cell effector function may contribute to increased susceptibility to infection in SLE patients. We sought to examin
Externí odkaz:
https://doaj.org/article/b6620691ee4440908663b9499e422f95
Autor:
Ching-Yu Chiang, Cheng-Yu Lee, Cheng-En Ho, C. R. Kao, Wan-Zhen Hsieh, Y.H. Huang, Pei-Tzu Lee, Ching-Shun Ku
Publikováno v:
Journal of Materials Research and Technology, Vol 13, Iss, Pp 1316-1322 (2021)
The allotropic phase transformation of Cu6Sn5 from a hexagonal (η) to monoclinic (η′) structure at 186 °C is scientifically interesting and technologically important. As the η′ lattice is crystallographically pseudosymmetrical with η, the id
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f96d5ffdabd3131db877995328b34e2b
https://doi.org/10.1016/j.jmrt.2021.05.045
https://doi.org/10.1016/j.jmrt.2021.05.045
Publikováno v:
Mediators of Inflammation, Vol 2016 (2016)
Adhesion molecules may play an important role in systemic lupus erythematosus (SLE) pathogenesis. We investigated the effect of interleukin- (IL-) 15 on CD11b, CD54, and CD62L expression on natural killer (NK) cells, T cells, and CD56+CD3+ NKT-like c
Externí odkaz:
https://doaj.org/article/69082f505dc9425b8a15b7b1cda50c15
Publikováno v:
Journal of Materials Research and Technology, Vol 9, Iss 6, Pp 12946-12954 (2020)
Metallurgical systems containing substantial amounts of metallic indium have always been very challenging to investigate due to the difficulties involved with sample characterization caused by the substantial softness of indium. Such difficulties are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5d25dbbd68c34f3e587cd6cf6c54561f
http://www.sciencedirect.com/science/article/pii/S2238785420317695
http://www.sciencedirect.com/science/article/pii/S2238785420317695
Publikováno v:
Materials & Design, Vol 206, Iss, Pp 109830-(2021)
The fabrication of Cu pillars has recently attracted much attention from the microelectronic/communication industry because pillars can act as thermal dissipation devices and electrical interconnections among different packaging levels, providing eff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::60efe2915ba4d644ea19e863f9678643
http://www.sciencedirect.com/science/article/pii/S026412752100383X
http://www.sciencedirect.com/science/article/pii/S026412752100383X