Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Pei Sheng Liu"'
Publikováno v:
Nuclear Science and Techniques. 33
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed9225128792cfddd9d36a1ae6cbc888
https://doi.org/10.1007/s41365-022-01020-2
https://doi.org/10.1007/s41365-022-01020-2
Autor:
Jianfeng Wu, Zhonghao Tao, Yueyue Xu, Pei-sheng Liu, Xin Chen, Wen Chen, Liangpeng Li, Rui Wang, Shuai He, Yide Cao
Publikováno v:
Canadian Journal of Cardiology. 35:490-500
Background The IκB kinase (IKK) complex has been found to have critical functions in cancer and the immune system. In particular, IKKα, which is a member of the IKK complex, has been shown to influence the inflammatory response and malignant diseas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eaf436f2674ae64b24749e5207af768c
https://doi.org/10.1016/j.cjca.2019.01.002
https://doi.org/10.1016/j.cjca.2019.01.002
Publikováno v:
The Scientific World Journal, Vol 2013 (2013)
The effect of donor-like surface traps on two-dimensional electron gas (2DEG) and drain current collapse of AlGaN/GaN high electron mobility transistors (HEMTs) has been investigated in detail. The depletion of 2DEG by the donor-like surface states i
Externí odkaz:
https://doaj.org/article/e38a16f966704940a8c20af069075d74
Publikováno v:
Transactions of Nonferrous Metals Society of China. 28:1334-1341
Using the three-dimensional reticular nickel foam as experimental material, the sound absorption performance was investigated for several various multilayer structures in the frequency range of 2000–4000 Hz, which is aurally sensitive for human ear
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66b1d9af73db33b68258a0c16e5448fa
https://doi.org/10.1016/s1003-6326(18)64771-5
https://doi.org/10.1016/s1003-6326(18)64771-5
Publikováno v:
Transactions of Nonferrous Metals Society of China. 27:1989-1995
Commercial 3D reticular nickel foam and its composite structure were investigated on the sound absorption at 200-2000 Hz. The absorption performance of foam plates 1-5 layers (1-layer thickness: 2.3 mm; porosity: 89%; average pore-diameter: 0.57 mm)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6148f1493d18a6f591137239f087621e
https://doi.org/10.1016/s1003-6326(17)60223-1
https://doi.org/10.1016/s1003-6326(17)60223-1
Publikováno v:
Journal of Iron and Steel Research International. 24:661-668
A sort of lightweight porous ceramic foam ball that can float on the water was recently made from the natural zeolite. The diameters of porous ball and its macroscopic pores are around 5 and 1 mm, respectively. Such ball surface could be modified to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8bfd8ef96dccc0f6a666cde68b82e44
https://doi.org/10.1016/s1006-706x(17)30099-7
https://doi.org/10.1016/s1006-706x(17)30099-7
Publikováno v:
Materials Letters. 182:273-276
A novel sort of reticular ceramic foam, which could float on the water, was made from natural zeolite powder. A thin film of Prussian blue analogue could grow on and firmly combine with the desilicated ceramic surface of this foam. The present analog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c32dd2e10bc250879985407000a42cc
https://doi.org/10.1016/j.matlet.2016.07.019
https://doi.org/10.1016/j.matlet.2016.07.019
Publikováno v:
Key Engineering Materials. :319-324
Electro-migration has become a critical reliability issue for high density solder joints in flip chip technology, especially for current crowding and joule heat. Electro-migration force and mean time to failure of flip chip are introduced in this pap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3416fdc1b1b66ec2722365aa01173c2
https://doi.org/10.4028/www.scientific.net/kem.645-646.319
https://doi.org/10.4028/www.scientific.net/kem.645-646.319
Publikováno v:
Key Engineering Materials. :226-231
Due to the application of lead-free solders, the quality and reliability of plastic packaging device are influenced by the increase of reflow temperature. In this paper, a low-profile quad flat package (LQFP) is chosen to illustrate the interface def
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::088ec4aadcbe286ba6195ac98109261a
https://doi.org/10.4028/www.scientific.net/kem.645-646.226
https://doi.org/10.4028/www.scientific.net/kem.645-646.226
Autor:
kimwonkyoung, Pei Sheng Liu
Publikováno v:
Journal of Digital Design. 14:713-723
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed5d9db550174129c0493eec32d6b113
https://doi.org/10.17280/jdd.2014.14.2.067
https://doi.org/10.17280/jdd.2014.14.2.067