Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Pawel Czubarow"'
Autor:
Pawel Czubarow, Horace S. Isbell
Publikováno v:
ChemInform. 22
Publikováno v:
2010 IEEE CPMT Symposium Japan.
Capillary type underfill is still the mainstream underfill for mass production flip chip applications. Flip chip packages are migrating to ultra low-k, Pb-free, 3D and fine pitch packages. Underfill selection is becoming more critical. This paper dis
Publikováno v:
Carbohydrate Research. 224:327-330
Publikováno v:
Applied Physics Letters. 107:221603
Thermal transport across organic-inorganic interfaces is fundamental to understanding heat transfer in polymer-based composites, microelectronics, and energy conversion systems. We used the Langmuir-Blodgett (LB) technique to deposit nanometer-thick
Publikováno v:
Chemical Vapor Deposition. 1:51-53
Autor:
Pawel Czubarow, Dietmar Seyferth
Publikováno v:
Chemistry of Materials. 6:10-12
Autor:
Pawel Czubarow, Horace S. Isbell
Publikováno v:
Carbohydrate Research. 203:287-289
Autor:
Pawel Czubarow, Chaitanya K. Narula, A. Gandopadhyay, L. F. Allard, P. Schmitz, Mark P. Everson, C. H. Winter, A. Varshney, T. Suren Lewkbandara, Dietmar Seyferth
Publikováno v:
MRS Proceedings. 495
The promise of new applications continues to drive research on ceramic precursor and sol-gel routes to materials preparation. These routes offer flexibility in the fabrication of materials in forms such as films, coatings, fibers, foams, and powders,