Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Pavel Roy Paladhi"'
Autor:
Pavel Roy Paladhi, Yanyan Zhang, Xianbo Yang, Nam Pham, Megan Nguyen, Mahesh Bohra, Junyan Tang, Sungjun Chun, Joshua Myers, Wiren Becker, Daniel Dreps
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d47ccc8d7f016a55b6ff64cb7d12e00
https://doi.org/10.1109/epeps53828.2022.9947103
https://doi.org/10.1109/epeps53828.2022.9947103
Autor:
Pavel Roy Paladhi, Hakki Mert Torun, Madhavan Swaminathan, Wiren D. Becker, Xianbo Yang, Jose A. Hejase, Yanyan Zhang, Junyan Tang
Publikováno v:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97fb8ed310b17a7262ca60a02942a265
https://doi.org/10.1109/epeps51341.2021.9609205
https://doi.org/10.1109/epeps51341.2021.9609205
Autor:
Xianbo Yang, Osama Waqar Bhatti, Madhavan Swaminathan, Nikita Ambasana, Pavel Roy Paladhi, Wiren D. Becker, Majid Ahadi Dolatsara
Publikováno v:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::892daf47fff18ee76aa689bfe793a63d
https://doi.org/10.1109/epeps51341.2021.9609225
https://doi.org/10.1109/epeps51341.2021.9609225
Autor:
Evan Fledell, Elmar Griese, Mohamed Sahouli, Jonatan Aronsson, Jose A. Hejase, Wui-Weng Wong, Feng Ling, Ali E. Yilmaz, Fei Guo, Kemal Aygun, Thomas-Michael Winkel, Rohit Sharma, W. Dale Becker, Michael J. Hill, Kaisheng Hu, Stefano Grivet Talocia, Yi-Ru Jeong, Zhen Peng, Heidi Barnes, Pavel Roy Paladhi, Alexander Pelger, Tingdong Zhou, Jose E. Schutt-Aine, Benjamin Silva, Nam H. Pham, Chang Liu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4d763c4358516114c10adcfe1e0fd0a1
http://hdl.handle.net/11583/2947707
http://hdl.handle.net/11583/2947707
Autor:
Wiren D. Becker, Daniel M. Dreps, Pavel Roy Paladhi, Brian Samuel Beaman, Yanyan Zhang, Jose A. Hejase, Junyan Tang, Daniel Rodriguez, Sungjun Chun
Publikováno v:
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
A comprehensive signal integrity model to hardware correlation study on an improved, 44 Gb/s capable, hybrid land grid array (HLGA) socket connector design is presented. The connector only design SI performance is shown through 3D electromagnetic (EM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18caab087dcff7de491f99354276ba92
https://doi.org/10.1109/epeps48591.2020.9231393
https://doi.org/10.1109/epeps48591.2020.9231393
Publikováno v:
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
The characterization of the signal integrity (SI) performance of differential high-speed channels that have an imbalance due to mismatched via stub length is investigated. The impact of the asymmetric stubs are characterized with regards to impedance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eabcb5c1ec7e3ba9a4a57daab1c8a909
https://doi.org/10.1109/epeps48591.2020.9231479
https://doi.org/10.1109/epeps48591.2020.9231479
Autor:
Yanyan Zhang, Pavel Roy Paladhi, Sungjun Chun, Lei Shan, Jose A. Hejase, Jean Audet, Mahesh Bohra, Wiren D. Becker, Daniel M. Dreps
Publikováno v:
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
A novel edge card connector design approach with tunable signal integrity (SI) properties is proposed. The tunability is achieved through the presence or absence of a grounded conductive fixture in between the connector pin rows. The main purpose of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64736c919272eb2e598c24d0968f5c23
https://doi.org/10.1109/epeps47316.2019.193238
https://doi.org/10.1109/epeps47316.2019.193238
Autor:
Joshua C. Myers, Daniel M. Dreps, Prasanna Jayaraman, Wiren D. Becker, Junyan Tang, Pavel Roy Paladhi, Yanyan Zhang, Nam H. Pham, Sungjun Chun, Jose A. Hejase
Publikováno v:
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
While equalization is usually a positively contributing factor towards opening eye diagrams further, sometimes over equalization can occur and degrade an eye opening as opposed to improve it. This paper explores the effectiveness of using post-cursor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e59a3349a92dbdbd36ef876f514eda04
https://doi.org/10.1109/epeps47316.2019.193221
https://doi.org/10.1109/epeps47316.2019.193221
Publikováno v:
Progress In Electromagnetics Research B. 66:1-13
Filtered backpropagation (FBPP) is a well-known technique used in Diffraction Tomography (DT). For accurate reconstruction of a complex-valued image using FBPP, full 360 ◦ angular coverage is necessary. However, it has been shown that by exploiting
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::700aa33f8681ac21fd1572d473fafb2f
https://doi.org/10.2528/pierb15120204
https://doi.org/10.2528/pierb15120204
Autor:
Daniel M. Dreps, Wiren D. Becker, Sungjun Chun, Joshua C. Myers, Pavel Roy Paladhi, Jose A. Hejase, Junyan Tang
Publikováno v:
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
In this paper, transitions between substrate integrated waveguides (SIW) within a multi-layered printed circuit board (PCB) are studied. Particularly, horizontal (within the same layer) and vertical (between different layers) transitions are investig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a815518e3d99567abecbfd38d3807fb9
https://doi.org/10.1109/epeps.2018.8534285
https://doi.org/10.1109/epeps.2018.8534285