Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Pavan Kumar Vaitheeswaran"'
Publikováno v:
Algorithms, Vol 13, Iss 4, p 82 (2020)
Point projection is an important geometric need when boundaries described by parametric curves and surfaces are immersed in domains. In problems where an immersed parametric boundary evolves with time as in solidification or fracture analysis, the pr
Externí odkaz:
https://doaj.org/article/54dd2123a2b9419a82ee488cecac5384
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:426-443
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f52b6bb1847e74d7c2210f5be899be4a
https://doi.org/10.1109/tcpmt.2023.3259299
https://doi.org/10.1109/tcpmt.2023.3259299
Publikováno v:
Computational Mechanics. 66:373-390
Electromigration in electrical interconnects with high current density causes voids to form and grow near the cathode. These voids can possibly grow large enough to cause open circuit failure. The simulation of electromigration void nucleation and gr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1aa2aee6e3b5925439b106310b5d7975
https://doi.org/10.1007/s00466-020-01855-9
https://doi.org/10.1007/s00466-020-01855-9
Publikováno v:
Continuum Mechanics and Thermodynamics. 32:987-1010
In this paper, the thermodynamic configurational force associated with a moving interface is used to derive the conditions for phase growth and nucleation in bodies with multiple diffusing species and arbitrary surface stress at the phase interface.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a62b0561e243158fd7d3740ed6cedba
https://doi.org/10.1007/s00161-019-00804-z
https://doi.org/10.1007/s00161-019-00804-z
Autor:
Y-J. Park, Jayhoon Chung, Srikanth Krishnan, Pavan Kumar Vaitheeswaran, C-S. Lee, Ganesh Subbarayan
Publikováno v:
IRPS
Design rules for specification of current densities in lines are driven by consideration of possible failure mechanisms. Under large amplitude intermittent current pulses, thermal stresses are the dominant cause for failure, with chief failure mechan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1afbf6beb7281e4672d79a041de83eb
https://doi.org/10.1109/irps45951.2020.9128331
https://doi.org/10.1109/irps45951.2020.9128331
Publikováno v:
Algorithms
Volume 13
Issue 4
Algorithms, Vol 13, Iss 82, p 82 (2020)
Volume 13
Issue 4
Algorithms, Vol 13, Iss 82, p 82 (2020)
Point projection is an important geometric need when boundaries described by parametric curves and surfaces are immersed in domains. In problems where an immersed parametric boundary evolves with time as in solidification or fracture analysis, the pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::03c6ce0bc5f1ac8cf3c3e00c0a4cafee
Publikováno v:
Proceedings of CAD'19.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b3d774f0297f1dff9137c03c1e689bad
https://doi.org/10.14733/cadconfp.2019.456-461
https://doi.org/10.14733/cadconfp.2019.456-461
Publikováno v:
Journal of Electronic Packaging. 140
Particulate thermal interface materials (TIMs) are commonly used to transport heat from chip to heat sink. While high thermal conductance is achieved by large volume loadings of highly conducting particles in a compliant matrix, small volume loadings
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adb32baff6c1fb22a3b8353aa989012f
https://doi.org/10.1115/1.4039136
https://doi.org/10.1115/1.4039136
Publikováno v:
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Particulate thermal interface materials (TIMs) are commonly used to transport heat from chip to heat sink. While high thermal conductance is achieved by large volume loadings of highly conducting particles in a compliant matrix, small volume loadings
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fde5e8f73aba5b6c547dbf222e8d6fb
https://doi.org/10.1115/ipack2017-74129
https://doi.org/10.1115/ipack2017-74129