Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Paul Timans"'
Autor:
James Chen, Dimitar Dimitrov, Tatiana Dimitrova, Paul Timans, Jeff Gelpey, Steve McCoy, Wilfried Lerch, Silke Paul, Detlef Bolze, Edmund G. Seebauer, Susan B. Felch, Amitabh Jain, Yevgeniy V. Kondratenko
Publikováno v:
AIP Conference Proceedings.
The aim of this report is to present and justify a new approach for carrier density profiling in ultra‐shallow junction (USJ) layer. This new approach is based on a capacitance measurement model, which takes series impedance, shunt resistance and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a70372e77c9f30adc11acf77d364f67f
https://doi.org/10.1063/1.3033588
https://doi.org/10.1063/1.3033588
Autor:
Paul Timans, Yao Zhi Hu, Jeff Gelpey, Steve McCoy, Wilfried Lerch, Silke Paul, Detlef Bolze, Hamid Kheyrandish, Edmund G. Seebauer, Susan B. Felch, Amitabh Jain, Yevgeniy V. Kondratenko
Publikováno v:
AIP Conference Proceedings.
Low thermal budget annealing approaches, such as millisecond annealing or solid‐phase epitaxy (SPE), can electrically activate ultra‐shallow junctions (USJ) without excessive diffusion, but they must also remove implant damage to minimize junctio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d3a47e31210169dd1807fb2dd6d3da0
https://doi.org/10.1063/1.3033685
https://doi.org/10.1063/1.3033685