Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Paul S. Andry"'
Autor:
D. McHerron, Katsuyuki Sakuma, Paul S. Andry, Cyril Cabral, Mukta G. Farooq, Rama Divakaruni, Thomas A. Wassick
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:875-878
In this letter, we have demonstrated a packaging technique for 3-D IC with Cu back-end-of-the line (BEOL) on a mixed pitch (55 and $75~\mu \text{m}$ ) advanced ground-rule laminate by developing a 3-D die-stack on substrate (3D-DSS) technology. 3-D D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53f4b622692f1c0da4c9b657453edd4f
https://doi.org/10.1109/tcpmt.2021.3073403
https://doi.org/10.1109/tcpmt.2021.3073403
Autor:
Maryse Cournoyer, Hiroyuki Mori, Ravi K. Bonam, Marc A. Bergendahl, Paul S. Andry, Dishit P. Parekh, Isabel de Sousa, Kamal K. Sikka, Aakrati Jain, Pascale Gagnon, Rama Divakaruni, Thomas A. Wassick, Ed Cropp, Hongqing Zhang, Yang Liu, Sayuri Kohara, Catherine Dufort
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We introduce a new packaging technology termed as Direct Bonded Heterogeneous Integration (DBHi) where a Si-bridge is directly bonded to and in between processor chips using Cu pillars, allowing high-bandwidth low-latency low-power communication betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::960ccc6b8b26dfdd3b11d507ce84411f
https://doi.org/10.1109/ectc32696.2021.00034
https://doi.org/10.1109/ectc32696.2021.00034
Autor:
Thomas A. Wassick, Paul S. Andry, Cyril Cabral, Russell Kastberg, Shidong Li, Mukta G. Farooq, Katsuyuki Sakuma, D. McHerron, Rajalingam Sankeerth
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this work, a 3D Die-Stack on Substrate (3D-DSS) bonding process has been developed to demonstrate a 3D die stack that has been joined to a mixed pitch ( $5\ \mu\mathrm{m}\ /\ 75\ \mu \mathrm{m}$ ) high density interconnect laminate. By using the 3
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c8d33e01175c04db3b25994a694d1ea
https://doi.org/10.1109/ectc32696.2021.00056
https://doi.org/10.1109/ectc32696.2021.00056
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
We developed a tool of molten solder injection which is able to form solder bumping on wafers, ceramic/organic substrates, flexible circuits, and Si via filling from fine pitch to large pitch. One tool has capabilities of solder bumping on wafers fro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9eb3485c377752a7a564874e70706fc0
https://doi.org/10.1109/ectc.2018.00105
https://doi.org/10.1109/ectc.2018.00105
Autor:
Timothy J. Chainer, Cornelia K. Tsang, Joana Maria, Qianwen Chen, Paul S. Andry, Cyril Cabral, Mark D. Schultz
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this paper we present a novel approach to addressing the challenges of integrating embedded cooling into 3D chip stacks with multiple large high power die layers. 3D chip stacks require the integration of through silicon vias (TSVs) in the active
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c02efec021e25c0f71d56a696e00382
https://doi.org/10.1109/ectc.2018.00023
https://doi.org/10.1109/ectc.2018.00023
Autor:
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Yang Liu, Li-Wen Hung, Hongqing Zhang, Tom Wassick, Qianwen Chen
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper reports on a feasibility study of using infrared (IR) laser ablation for silicon handler debonding for the first time. Various lasers were evaluated for the transmission through a Si handler and several release layers were studied for on l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71775a09b0ba22a35201ec559ddfee38
https://doi.org/10.1109/ectc.2016.288
https://doi.org/10.1109/ectc.2016.288
Autor:
Yong Liu, John U. Knickerbocker, Xiaoxiong Gu, Paul S. Andry, Cornelia K. Tsang, Bing Dang, John F. Bulzacchelli, Daniel J. Friedman, Sergey V. Rylov, Herschel A. Ainspan, Benjamin D. Parker, Lavanya Turlapati, Timothy O. Dickson, Michael P. Beakes
Publikováno v:
IEEE Journal of Solid-State Circuits. 47:884-896
A source synchronous I/O system based on high-density silicon carrier interconnects is introduced. Benefiting from the advantages of advanced silicon packaging technologies, the system uses 50 μm-pitch μC4s to reduce I/O cell size and fine-pitch in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33f6f151920f35ece312be42edfebf81
https://doi.org/10.1109/jssc.2012.2185184
https://doi.org/10.1109/jssc.2012.2185184
Autor:
Luca P. Carloni, Naigang Wang, Bing Dang, Eugene J. O'Sullivan, Kenneth L. Shepard, William J. Gallagher, Michele Petracca, Paul S. Andry, Noah Sturcken, Kevin Tien, Jae-Woong Nah
Publikováno v:
VLSIC
This paper presents a three-dimensional (3D) fully integrated high-speed multiphase voltage regulator. A complete switched-inductor regulator is integrated with a four-plane NoC in a two-high chip stack combining integrated magnetics, through-silicon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5cb4798b1647520b8fbbb48b4418b93a
https://doi.org/10.1109/vlsic.2015.7231375
https://doi.org/10.1109/vlsic.2015.7231375
Autor:
Bucknell C. Webb, Paul S. Andry
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Temporary wafer bonding and debonding techniques are becoming ubiquitous in the world of 2.5D and 3D technology. After a decade of research and development, two room-temperature debonding techniques have emerged as industry front-runners: laser-assis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88faaf56c7f448511f2c12bd75d33bc9
https://doi.org/10.1109/ectc.2015.7159784
https://doi.org/10.1109/ectc.2015.7159784
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e782d053e0d089ec3e212b7635525933
https://doi.org/10.1109/ectc.2014.6897343
https://doi.org/10.1109/ectc.2014.6897343