Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Paul Rissman"'
Publikováno v:
SPIE Proceedings.
In order to achieve an economical design-to-mask (DTM) development cycle in the low k1 domain, designers, lithographers, and mask makers needed to move away from many sequentially isolated developmental activities onto one collaborative environment m
Publikováno v:
SPIE Proceedings.
The ITRS roadmap1 lists double patterning 193 nm immersion exposure with inverse lithography as the likely solution through the 22 nm half pitch generation. Three different patterns, scaled to 56 nm pitch, were explored using inverse lithography.2,3
Publikováno v:
SPIE Proceedings.
This paper presents ILT masks written by a DUV laser writer and a VSB e-beam writer, and their corresponding wafer print results. ILT mathematically determine the mask features that produce the desired on-wafer results. ILT-generated masks sometimes
Autor:
J. E. Turner, Krishna Shenai, Shuit-Tong Lee, E.A. Perez-Albuerne, R. R. Speth, N. Meyyappan, D. Dallmann, John H. Booske, J. B. Kruger, Ling Zhang, Matthew Goeckner, Paul Rissman, J. L. Shohet
Publikováno v:
Applied Physics Letters. 65:962-964
The initial results from an investigation into the feasibility of using plasma source ion implantation (PSII) to produce separation by implantation of oxygen structures in silicon are reported. Oxygen ions are implanted into p‐type (111) oriented s
Publikováno v:
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 29:06FC17
The EVG 620 nanoimprint system is a 4 in. full wafer system suitable for university and research environments (EV Group, A-4782 Sankt Florian am Inn, Austria). By limiting the area printed and by the use of hard masks, nanoimprint lithography resolut
Publikováno v:
IEEE Transactions on Plasma Science. 24:75-76
In plasma processing, especially during the etching process in microelectronics, and as the feature size decreases, charging damage to thin gate oxides can be produced which does not occur when wet chemical processes are used. It is currently believe
Autor:
Geraint Owen, Paul Rissman
Publikováno v:
Journal of Applied Physics. 54:3573-3581
Compensation for the proximity effect in electron lithography can be achieved by equalization of the backscattered dose received by all pattern points. This is accomplished by exposing the reverse tone of the required pattern with a beam diameter dc=
Autor:
Paul Rissman, Thomas Palholmen
Publikováno v:
Solid-State Electronics. 17:611-615
Photoresist technology can be used to prepare superconductive tunnel junctions and arrays. Niobium thin films, which produce durable junctions, are chemically etched to form the base superconductor. NbNbOxPb junctions continue to function after
Autor:
Paul Rissman
Publikováno v:
World Archaeology. 20:209-228
The distribution of material goods in hoards and in funeral offerings is tabulated and summarized for the Harappan Civilization of Bronze Age South Asia. It is argued that hoards are private, secular deposits, while grave goods are public, ritualized
Publikováno v:
Environment: Science and Policy for Sustainable Development. 13:15-45