Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Paul Mumby-Croft"'
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A simulation driven study is presented relating to the reliability of high power semiconductor module busbars under vibrational loading. Unexpected mechanical failure presented under qualification testing leading to an in depth study of the geometry
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c43837617b197be8a792b12f0ac032c
https://doi.org/10.1109/eurosime.2019.8724521
https://doi.org/10.1109/eurosime.2019.8724521
Publikováno v:
Disruptive Wide Bandgap Semiconductors, Related Technologies, and Their Applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf079ec374797c12b8fa0bc2b9293b13
http://www.intechopen.com/articles/show/title/high-performance-packaging-technology-for-wide-bandgap-semiconductor-modules
http://www.intechopen.com/articles/show/title/high-performance-packaging-technology-for-wide-bandgap-semiconductor-modules
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Mechanical failures of wedge bonded aluminium wire interconnects are identified as a failure mode in power electronics modules and these wirebonds are often encapsulated in a variety of insulating media to improve electrical isolation and lifetime. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76a317f99433bfa5e32880f3c8d0557a
https://doi.org/10.1109/icept.2018.8480816
https://doi.org/10.1109/icept.2018.8480816
Publikováno v:
2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
Silver sinter technology is a very promising lead free interconnection method with high operating temperature, high thermal and electrical conductivity. In high power semiconductor modules the die attach material connects the die to the insulating su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e788e2cec8e902be756d15fa0f383d4
https://doi.org/10.1109/apec.2017.7931138
https://doi.org/10.1109/apec.2017.7931138
Autor:
Xiaoping Dai, Guoyou Liu, Paul Mumby-Croft, James Booth, Yangang Wang, Ma Yaqing, Yun Li, Matthew Packwood, Yibo Wu, Steve Jones
Publikováno v:
2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe).
Packaging of power semiconductor modules is facing huge challenges from automotive customers in terms of performance, temperature, reliability, weight, volume and cost etc. It is believed that choice of the power module structure, material and assemb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d344df36a275d4ee2cc528e51ce8c6f8
https://doi.org/10.1109/epe.2016.7695564
https://doi.org/10.1109/epe.2016.7695564
Autor:
L. Achouri, Paul Mumby-Croft, I. Stefan, P. Leleux, Kelly Vaughan, Douglas Robertson, Nicolas de Séréville, Jürgen Kiener, Pierre Descouvemont, E. Casarejos, N. A. Orr, A. Coc, F. Hammache, Vincent Tatischeff, T. Davinson, A. Lefebvre-Schuhl, Alison Laird, S. P. Fox, Pierpaolo Figuera, C. Angulo
Publikováno v:
International Symposium on Nuclear Astrophysics--Nuclei in the Cosmos--IX
International Symposium on Nuclear Astrophysics--Nuclei in the Cosmos--IX, Jun 2006, Genève, Switzerland
HAL
International Symposium on Nuclear Astrophysics--Nuclei in the Cosmos--IX, Jun 2006, Genève, Switzerland
HAL
International audience; The 18F nucleus is one of the radioactive isotopes produced during nova explosions. It is of particular interest since it is mainly responsible for the 511 keV gamma-ray emission of novae that could be detected with the INTEGR
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::443ee21808860384f2d65df7e518f096
https://doi.org/10.22323/1.028.0005
https://doi.org/10.22323/1.028.0005