Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Paul Gierth"'
Publikováno v:
Materials and Corrosion. 71:1832-1841
Adhesives are widely used in electronic packaging and of vital importance of the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in life time prediction. Unfortun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44cba5d734f7412a03bb8f4ee416c11c
https://doi.org/10.1002/maco.202011772
https://doi.org/10.1002/maco.202011772
Publikováno v:
Microelectronics International. 35:164-171
Purpose The purpose of this paper is to analyze a presentation of eddy current sensing coils for the turbo charger speed measurement, which were manufactured with the low temperature co-fired ceramic (LTCC) technology. The goal is to be able to manuf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fc0d69814de0f6d49b5c71fd3af58fd7
https://doi.org/10.1108/mi-12-2017-0067
https://doi.org/10.1108/mi-12-2017-0067
Publikováno v:
Journal of Sensors and Sensor Systems, Vol 7, Pp 43-49 (2018)
Measurement of temperatures in engine and exhaust systems in automotive applications is necessary for thermal protection of the parts and optimizing of the combustion process. State-of-the-art temperature sensors are very limited in their response ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::784f6be8b07aee913d03f82d30b04a45
https://www.j-sens-sens-syst.net/7/43/2018/
https://www.j-sens-sens-syst.net/7/43/2018/
Autor:
Lars Rebenklau, Paul Gierth
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Many sensor applications, particularly that of harsh environmental conditions, require high temperature stable interconnection techniques and materials. Monometallic Au-Au or Al-Al bonds have already been evaluated to be acceptable for temperatures o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f4821a57ab992ad8c22637cd0f58995
https://doi.org/10.1109/estc.2018.8546509
https://doi.org/10.1109/estc.2018.8546509
Autor:
L. Lippmann, Lars Rebenklau, F. Bechtold, H. Grießmann, Klaus Augsburg, Axel Wodtke, Lars Niedermeyer, K. Irrgang, Paul Gierth
Publikováno v:
Scopus-Elsevier
Nearly every industrial application needs temperature measurement. Typical temperature sensors are based on thermocouples or resistance elements. Nevertheless, these sensors are not always desired for every application. For example, temperature sensi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f49a837fa777aa71d4b1bc569c7e22a3
https://doi.org/10.4071/cicmt-wp14
https://doi.org/10.4071/cicmt-wp14
Autor:
Markus Eberstein, Thomas Mikolajick, Daniel K. Simon, Andreas Waltinger, Jan Gärtner, Niels Schilling, Paul Gierth, Stefan Koerner, Barbara Leszczynska, Jens Krause, Ines Dani, Lars Rebenklau, Ingo Dirnstorfer, Paul M. Jordan
Publikováno v:
Energy Procedia. 77:458-463
A silicon heterojunction solar cell based on amorphous and crystalline silicon is combined with the metal wrap through technology. In this novel solar cell concept one critical process is the via hole conditioning. Raman measurements reveal that the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::80b3a9892f76d259919950ed69ab83d9
Publikováno v:
Energy Procedia. 38:423-429
In this study we show that the electrical characteristics of low temperature polymer pastes are improved by carrying out the curing process in an inert nitrogen atmosphere. In order to reduce the solar cell production costs, numerous scientific works
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::659bde3570e347e667d7b14dd454b38d
Publikováno v:
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology.
The long time stability of solder joints on Ag-based thick film pastes has been studied. Therefore shear strength, electrical resistance, temperature coefficient of resistance (TCR), optical inspections of solder surface and cross section analyses ha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca0ef6a624a6f898dea1de68fa7ecb6f
https://doi.org/10.1109/isse.2014.6887580
https://doi.org/10.1109/isse.2014.6887580
Autor:
Lars Rebenklau, Paul Gierth
Publikováno v:
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology.
Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b8708709710a3bd1848d0970a734751
https://doi.org/10.1109/isse.2014.6887551
https://doi.org/10.1109/isse.2014.6887551
Publikováno v:
2012 35th International Spring Seminar on Electronics Technology.
Solar cells have to be connected electrically to each other in a solar module. During the last years, new connection techniques with low stress have been developed, such as selective soldering. The industrially most frequently used selective solderin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d900895434c4c46f169a6c229176d085
https://doi.org/10.1109/isse.2012.6273123
https://doi.org/10.1109/isse.2012.6273123