Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Paul F. Hlava"'
Publikováno v:
Metallurgical and Materials Transactions A. 41:3042-3052
The interface microstructures and dissolution behavior were studied, which occur between 99.9 pct Pd substrates and molten 95.5Sn-3.9Ag-0.6Cu (wt pct, Sn-Ag-Cu) solder. The solder bath temperatures were 513 K to 623 K (240 °C to 350 °C). The immers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::002d20b533d1c9beee1c50d8a99f2be5
https://doi.org/10.1007/s11661-010-0406-0
https://doi.org/10.1007/s11661-010-0406-0
Publikováno v:
Metallurgical and Materials Transactions A. 41:3053-3064
The interface microstructures as well as the rate kinetics of dissolution and intermetallic compound (IMC) layer formation were investigated for couples formed between molten 63Sn-37Pb (wt pct) solder and 99.9 pct Pd sheet. The solder bath temperatur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5d23904805607f256d3a8167f891f54
https://doi.org/10.1007/s11661-010-0379-z
https://doi.org/10.1007/s11661-010-0379-z
Publikováno v:
Journal of Materials Science. 44:545-555
Long-term metallurgical aging was studied in thermal switches comprised of 52In–48Sn (at.%) alloy solder plugs contained in Cu-plated stainless steel cylinders. These switches are locking devices designed so that, if overheated, a “fusible” all
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92c00fd9039d5ef389970e6f13184695
https://doi.org/10.1007/s10853-008-3083-2
https://doi.org/10.1007/s10853-008-3083-2
Publikováno v:
Metallurgical and Materials Transactions A. 38:2488-2502
The microstructure and rate kinetics were investigated for solid-state intermetallic compound (IMC) layer growth in Sn-Ag-Cu/Ag and Sn-Pb/Ag couples. The aging temperatures were 55 °C to 205 °C and 70 °C to 170 °C, respectively. The aging times w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::672a1a8d8969ac0dae03fe2e420777ef
https://doi.org/10.1007/s11661-007-9289-0
https://doi.org/10.1007/s11661-007-9289-0
Publikováno v:
Materials Science and Engineering: A. 432:149-157
This article summarizes results from a study directed toward evaluating electrodeposited 80Ni–20Fe as a structural material for the LIGA (German acronym for Lithographie, Galvanformung, Abformung, equivalent to lithography, electroplating and moldi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef2af4ce27355a3f69f6e6b57c361fc9
https://doi.org/10.1016/j.msea.2006.05.149
https://doi.org/10.1016/j.msea.2006.05.149
Publikováno v:
Materials Science and Engineering: A. 409:179-194
Solid-state interface reactions were investigated when Cu–Fe alloy leads were attached to an electroplated Au layer using 50In–50Pb (wt.%) solder. Two Au layers of different plating process quality were studied. The annealing temperatures were 70
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69b1a1f8bf52f8d189f28b17ac430daa
https://doi.org/10.1016/j.msea.2005.06.069
https://doi.org/10.1016/j.msea.2005.06.069
Publikováno v:
Journal of Electronic Materials. 33:991-1004
Long-term, solid-state intermetallic compound (IMC) layer growth was examined in 95.5Sn-3.9Ag-0.6Cu (wt.%)/copper (Cu) couples. Aging temperatures and times ranged from 70°C to 205°C and from 1 day to 400 days, respectively. The IMC layer thickness
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccc280f6c308cc8e14780d4278745e67
https://doi.org/10.1007/s11664-004-0026-9
https://doi.org/10.1007/s11664-004-0026-9
Publikováno v:
Metallurgical and Materials Transactions A. 34:2963-2972
A study was conducted to understand the wetting phenomena observed in brazing of a Ti-containing active filler metal on sapphire substrates. The goal of the study was to understand the interfacial reactions that permit wetting of commercial Ag-Cu-Ti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::951b84d5fb3e566567a3762ffed022c5
https://doi.org/10.1007/s11661-003-0195-9
https://doi.org/10.1007/s11661-003-0195-9
Autor:
Paul F. Hlava
Publikováno v:
Microscopy Today. 9:14-17
The colors that one sees when looking at a mineral or gemstone are due to the response of that person's eye to the energies of the light, the emission spectrum of the illumination, and, most importantly, physical phenomena in the material that cause
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eefc54f973ece2081063dac5dbc2de9c
https://doi.org/10.1017/s1551929500056406
https://doi.org/10.1017/s1551929500056406
Autor:
Patrick E. Haynes, Paul F. Hlava
Publikováno v:
Rocks & Minerals. 73:356-359
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4e3f9d4aef4c889f512cf1152890f04
https://doi.org/10.1080/00357529809603004
https://doi.org/10.1080/00357529809603004