Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Paul E. Calzada"'
Autor:
Md Sami Ul Islam Sami, Tao Zhang, Amit Mazumder Shuvo, Md Saad Ul Haque, Paul E. Calzada, Kimia Zamiri Azar, Hadi Mardani Kamali, Fahim Rahman, Farimah Farahmandi, Mark Tehranipoor
Publikováno v:
IEEE Access, Vol 12, Pp 48081-48107 (2024)
The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to overcome the slowdown in Moore’s Law and Dennard scaling and to resp
Externí odkaz:
https://doaj.org/article/e06012ab5b6e46eab6276bb8384472df
