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pro vyhledávání: '"Patrick T. Hulse"'
Publikováno v:
2012 IEEE International Reliability Physics Symposium (IRPS).
Microstructural considerations were studied in a tool qualification for ECP in a dual-damascene 110nm Cu/low-k BEOL process. Wafer Level tests (HTS, Isothermal EM) using standard SM/SIV and EM test structures were used to compare two ECP tools and ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::507096bb1667504058194e12b58c5c8a
https://doi.org/10.1109/irps.2012.6241897
https://doi.org/10.1109/irps.2012.6241897
