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pro vyhledávání: '"Patrick Po-Chun Huang"'
Autor:
Patrick Po-Chun Huang, John H. Lau, Chia-Yu Peng, Puru Bruce Lin, Jean-Jou Chen, Leo Chang, Hsing-Ning Liu, Eagle Lin, Cheng-Ta Ko, Tzyy-Jang Tseng, Tim Xia, Kai-Ming Yang
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1125-1137
In this article, the fan-out chip-last panel-level packaging for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a heterogeneous integrati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1df915bbdaec84b7ba821bc7d0fe0a8b
https://doi.org/10.1109/tcpmt.2020.2996658
https://doi.org/10.1109/tcpmt.2020.2996658
