Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Patrick Heinickel"'
Publikováno v:
tm - Technisches Messen. 79:496-503
Zusammenfassung Das Verbundelement als piezoresistives Hochdruck-Messelement für 5000 bar basiert auf einem neuartigen Prinzip der mechanischen Verspannung infolge allseitiger Druckbelastung. Der Einfluss des Dickenverhältnisses von Silizium und me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::056ae505c6f0b47d9c675926479f5313
https://doi.org/10.1524/teme.2012.0273
https://doi.org/10.1524/teme.2012.0273
Publikováno v:
Procedia Engineering. 25:603-606
This paper presents initial measurement results of the novel piezoresistive composite element at 500 MPa (5 000 bar or 72 500 psi). Comparative measurements with different layer thicknesses have been carried out successfully. While the expected sensi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf830691a210520c705de5044ba39604
https://doi.org/10.1016/j.proeng.2011.12.150
https://doi.org/10.1016/j.proeng.2011.12.150
Publikováno v:
Procedia Engineering. 5:665-668
This paper presents an optimization of a recently developed piezoresistive high-pressure composite element for measuring up to 500 MPa. The analytical description of the all-round pressurized sensing element results in a best ratio of layers’ thick
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a3dbddd3c930e08e1193c18bf5fe8b33
https://doi.org/10.1016/j.proeng.2010.09.197
https://doi.org/10.1016/j.proeng.2010.09.197
Publikováno v:
Proceedings SENSOR 2011.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::484902232ae992bc060bd19b511fadc1
https://doi.org/10.5162/sensor11/sp8.4
https://doi.org/10.5162/sensor11/sp8.4
Publikováno v:
2009 IEEE Sensors.
We report on the experimental comparison of piezoresistive MEMS sensors and optical fiber BRAGG grating sensors (FBGS) for strain measurements in force sensors. To our knowledge, this is the first direct comparison of piezoresistive and FBG transduce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bdae2024eda1b1b7fb5ce5f6db5bf52
https://doi.org/10.1109/icsens.2009.5398407
https://doi.org/10.1109/icsens.2009.5398407
Publikováno v:
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
This paper presents a novel miniaturized overload resistant piezoresistive silicon high-pressure sensor for a pressure range up to 500 MPa. The novel composite element is made of a solid body silicon chip with implanted piezoresistive resistors. A so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10efe244e5d385f6a5e9831f5dce5602
https://doi.org/10.1109/sensor.2009.5285517
https://doi.org/10.1109/sensor.2009.5285517
Publikováno v:
Procedia Engineering. :451-454
This paper presents various silicone encapsulations of the novel high-pressure composite element. Measurements at 100 MPa (1 000 bar or 14 500 psi) for different setups have been carried out successfully. The sensitivity of the softest truncated-cone
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::15a11a23db43e52607aa26e0a8544a66