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pro vyhledávání: '"Patrice Retho"'
Autor:
Jean-Baptiste Sauveplane, David Buso, Patrice Retho, Jean-Sébastien Lefrileux, Guy Perez, Norbert Venet
Publikováno v:
Microelectronics Reliability. 55:1815-1820
Area Array microelectronic package with small pitch and large I/O counts is now widely used in the ceramic packaging of microelectronics Integrated Circuit (IC). This kind of Land Grid Array (LGA) device cannot be directly soldered on Printed Circuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3e38b64baaf3acda8677d2625f5bece
https://doi.org/10.1016/j.microrel.2015.06.060
https://doi.org/10.1016/j.microrel.2015.06.060
