Zobrazeno 1 - 10
of 124
pro vyhledávání: '"Patrice Gonon"'
Autor:
M. Bonvalot, Youngjin Kim, Ji Hyeon Hwang, Patrice Gonon, Dong Hee Han, Woojin Jeon, Christophe Vallée, Seung-Woo Lee
Publikováno v:
IEEE Transactions on Electron Devices. 68:5753-5757
The operation speed of dynamic random access memory devices has been increasing with respect to the evolution of electronic devices. This in turn has induced a decrease in the allowed time for the operation. Therefore, the effective capacitance degra
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:19036-19043
Metal–Insulator–Metal (MIM) capacitors based on high-k oxides require stability with the applied electric field. However, experiment reveals a nonlinear behavior of capacitance with ac or dc bias. In this work, we measure capacitance–voltage no
Publikováno v:
Journal of Applied Physics
Journal of Applied Physics, 2020, 128 (13), pp.134101. ⟨10.1063/5.0025130⟩
Journal of Applied Physics, 2020, 128 (13), pp.134101. ⟨10.1063/5.0025130⟩
The electronic structure and optical properties of monoclinic HfO2 (m-HfO2) and HfO2:Al2O3 alloys, from the density functional theory (DFT), are investigated. The calculated lattice parameters and optical properties of m-HfO2 are consistent with the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::506127343383f431f6f765a780af83f8
https://hal.univ-grenoble-alpes.fr/hal-03867656
https://hal.univ-grenoble-alpes.fr/hal-03867656
Publikováno v:
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics, Springer Verlag, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Journal of Materials Science: Materials in Electronics, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Journal of Materials Science: Materials in Electronics, Springer Verlag, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Journal of Materials Science: Materials in Electronics, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Resistance switching is studied in conductive bridge memory structures made from atomic layer deposited HfO2 and Ag active electrode. Inert electrode is varied by using different substrates (TiN, W, Pt). HfO2 crystallinity is modified by varying the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aa1f13a4389edf4a9d2e9b247f8b2062
https://hal.univ-grenoble-alpes.fr/hal-02916808
https://hal.univ-grenoble-alpes.fr/hal-02916808
Autor:
Philippe Lentrein, Matthias Vidal-Dho, Q. Hubert, Pascal Fornara, Jean-Michel Moragues, Patrice Ray, Bernard Pelissier, Patrice Gonon
Publikováno v:
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS), May 2020, Edinburgh, United Kingdom. pp.1-4, ⟨10.1109/ICMTS48187.2020.9107909⟩
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS), May 2020, Edinburgh, United Kingdom. pp.1-4, ⟨10.1109/ICMTS48187.2020.9107909⟩
This paper presents a novel methodology to observe the leakage current origin in SiOC:H low-$\kappa$ intermetallic dielectric as well as a method to localise electrically the breakdown point in usual comb/serpentine/comb structures. Our results indic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bb1d8bff7790288ec93dd1af810fd697
https://hal.univ-grenoble-alpes.fr/hal-02916807
https://hal.univ-grenoble-alpes.fr/hal-02916807
Moisture Influence on Reliability and Electrical Characteristics of SiOC:H Low-k Dielectric Material
Autor:
Jean-Luc Ogier, Pascale Potard, Matthias Vidal-Dho, Bernard Pelissier, Q. Hubert, Jean-Philippe Escales, Pascal Fornara, Patrice Gonon, Jean-Michel Moragues
Publikováno v:
2019 IEEE International Integrated Reliability Workshop (IIRW).
This paper presents an in depth study of the moisture influence on reliability and electrical characteristics of SiOC:H low-κ dielectric material. Firstly, TDDB models have been evaluated on material without moisture and Impact Damage model is found
Publikováno v:
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2019, 66 (1), pp.402-406. ⟨10.1109/TED.2018.2881220⟩
IEEE Transactions on Electron Devices, 2019, 66 (1), pp.402-406. ⟨10.1109/TED.2018.2881220⟩
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2019, 66 (1), pp.402-406. ⟨10.1109/TED.2018.2881220⟩
IEEE Transactions on Electron Devices, 2019, 66 (1), pp.402-406. ⟨10.1109/TED.2018.2881220⟩
Metal–insulator–metal (MIM) diodes with bulk-limited current conduction asymmetry employing interposed Al2O3 layer in 6-nm-thick HfO2 film have been investigated. The current density is decreased as the Al2O3 layer is located far from the electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74ca06da97b9d432ee1bdc87f6f5bc10
https://hal.univ-grenoble-alpes.fr/hal-02325464
https://hal.univ-grenoble-alpes.fr/hal-02325464
Autor:
Patrice Gonon, Pascale Potard, Jean-Michel Mirabel, Jonathan Jacquot, Delphine Maury, Jean-Philippe Escales, Maxime Marchetti, Q. Hubert, Pascal Fornara, Olivier Pizzuto, Matthias Vidal-Dho, Philippe Delorme, Pascal Sallagoity, Jean-Michel Moragues, Ludovic Beauvisage
Publikováno v:
Conf. on Microelectronic Test Structures (ICMTS)
Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp.176-179
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS)
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp 176-179
Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp.176-179
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS)
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp 176-179
This paper underlines the damages induced by probing on narrow pads reliability of specifically designed test structures placed on dicing streets and indicates that probing during electrical test steps provokes detrimental cracks diving from the pass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a3ee63e3a5c25ae9fef6997ba49f793
https://hal.univ-grenoble-alpes.fr/hal-02362746
https://hal.univ-grenoble-alpes.fr/hal-02362746
Autor:
D. Nouguier, Ahmad Bsiesy, Claire Fenouillet-Beranger, N. Rambal, Xavier Federspiel, Christophe Licitra, Patrice Gonon, C. Guerin, S. Beaurepair, P-L. Charvet, Névine Rochat, Marc Veillerot, D. Ney, Vincent Jousseaume
Publikováno v:
IEEE Int. Interconnect Technology Conference (IITC)
IEEE Int. Interconnect Technology Conference (IITC), 2018, Santa Clara, United States. pp 61-63
IEEE Int. Interconnect Technology Conference (IITC), 2018, Santa Clara, United States. pp 61-63
This work presents an in-depth study of the thermal stability of low-k material in view of intermediate Back-End-Of-Line (iBEOL) for 3D sequential Integration. SiOCH ULK were analyzed after thermal annealing up to 600°C. Moreover, the stability and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44ed5abbfb3f02f569e74ad568ea315a
https://hal.univ-grenoble-alpes.fr/hal-01942970
https://hal.univ-grenoble-alpes.fr/hal-01942970
Publikováno v:
ECS Transactions. 67:99-110
This paper presents an overview of our work on metal-insulator-metal (MIM) structures used for resistive non-volatile resistive (RRAM) or dynamic (DRAM) random access memories. Atomic layer deposition technique is used to grow the insulator layer. AL