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pro vyhledávání: '"Pat Marmillion"'
Publikováno v:
SPIE Proceedings.
Defects are still one of the main challenges of extreme ultrav iolet (EUV) mask blanks. In particular, a majority(~75%) of substrate defects are nanometer size pits . These pits are usually created during final surface polishing of the synthetic, qua
Publikováno v:
SPIE Proceedings.
Extreme ultraviolet lithography (EUVL) is a strong contender for the 32 nm generation and beyond. A defect-free mask substrate is an absolute necessity for manufacturing EUV mask blanks. The mask blank substrates are, therefore, cleaned with differen
Publikováno v:
SPIE Proceedings.
Extreme ultraviolet (EUV) substrates have stringent defect requirements. For the 32 nm node, all particles larger than 26 nm must be removed from the substrate. However, real defects are irregularly shaped and there is no clear dimension for an irreg
Publikováno v:
23rd European Mask and Lithography Conference.
The capability of hydrogenated water to clean EUV blank substrates was examined. The hydrogenated water cleaning process was compared with an H 2 O 2 /NH 4 OH/H 2 O mixture (SC1) and ozonated water cleaning processes. A small amount ammonia added to
Publikováno v:
SPIE Proceedings.
Extreme ultraviolet lithography (EUVL) is being considered as the enabler technology for the manufacturing of future technology nodes (30 nm and beyond). EUV mask blanks are Bragg mirrors made of Mo and Si bilayers and tuned for reflectivity at a wav
Publikováno v:
SPIE Proceedings.
Extreme ultraviolet (EUV) mask blanks must have nearly zero defects larger than 30 nm. Mask blank defects are an accumulation of defects present on the substrate, defects added during the multilayer (ML) deposition process, and defects added by handl
Publikováno v:
22nd European Mask and Lithography Conference.
Publikováno v:
SPIE Proceedings.
Defects on an extreme ultraviolet (EUV) mask blank strongly depend on the defects on the mask blank substrate. Any imperfection on the substrate surface in the form of a particle, pit, and scratch will appear on the EUV mask blank. In this article, w
Autor:
Helmut Popp, Sean Eichenlaub, Abbas Rastegar, Pat Marmillion, Kurt Goncher, Sebastian Dietze, Yoshiaki Ikuta
Publikováno v:
SPIE Proceedings.
Low thermal expansion material (LTEM) substrates were cleaned with recipes developed to clean blank quartz substrates. These recipes were capable of cleaning the LTEM without damaging the LTEM substrate. No effect of etching doped metals in LTEM was
Publikováno v:
SPIE Proceedings.
Mask cleaning has been a significant challenge. Advanced PhotoMasks have proven to be even more difficult. The experimental work on 157nm systems uncovered an issue of particle growth under the pellicle. Since the mask blank had a different compositi