Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Pascale Gagnon"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1929-1937
Thermocompression bonding (TCB) is an important process in electronic packaging and is widely seen as a promising technology for miniaturized electronic devices. However, this process usually yields a lower throughput compared to more conventional ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b908a36cac2d69ea905df01db9e23a98
https://doi.org/10.1109/tcpmt.2020.3026927
https://doi.org/10.1109/tcpmt.2020.3026927
Autor:
Maryse Cournoyer, Hiroyuki Mori, Ravi K. Bonam, Marc A. Bergendahl, Paul S. Andry, Dishit P. Parekh, Isabel de Sousa, Kamal K. Sikka, Aakrati Jain, Pascale Gagnon, Rama Divakaruni, Thomas A. Wassick, Ed Cropp, Hongqing Zhang, Yang Liu, Sayuri Kohara, Catherine Dufort
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We introduce a new packaging technology termed as Direct Bonded Heterogeneous Integration (DBHi) where a Si-bridge is directly bonded to and in between processor chips using Cu pillars, allowing high-bandwidth low-latency low-power communication betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::960ccc6b8b26dfdd3b11d507ce84411f
https://doi.org/10.1109/ectc32696.2021.00034
https://doi.org/10.1109/ectc32696.2021.00034
Autor:
S. Ben Jemaa, Pascale Gagnon, P. Momar Souare, M. Kabirou Toure, A. Dione, Jf. Morissette, Julien Sylvestre
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Since its inception, the flip-chip bonding process has allowed for an ever-increasing density of interconnections in microelectronic packages. While traditional mass reflow (MR) soldering continues to be useful, alternative techniques such as thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::084182e88cfc6dfcb8cb310c6ab08c2e
https://doi.org/10.1109/ectc32862.2020.00043
https://doi.org/10.1109/ectc32862.2020.00043
Autor:
Divya Taneja, David Danovitch, Robert Martel, Pascale Gagnon, Catherine Dufort, Ahmed Chakroun
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Jun 2020, Orlando, United States. pp.1270-1276, ⟨10.1109/ECTC32862.2020.00203⟩
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Jun 2020, Orlando, United States. pp.1270-1276, ⟨10.1109/ECTC32862.2020.00203⟩
A study was conducted to determine the feasibility of using a pre-applied underfill (PAUF) and its associated Thermal Compression Bonding (TCB) process for challenging packaging applications such as large die 3D and very large die 2D configurations.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::54b90d5a39bfd4dd0b36567d5dd3be94
https://doi.org/10.1109/ectc32862.2020.00203
https://doi.org/10.1109/ectc32862.2020.00203
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Package on Package (PoP) technology can play a vital role in advanced packaging for various reasons. The use of a thin interposer allows for tighter wiring ground rules and can reduce die-to-die latency when placing either multiple die on a single in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f5ef4827208af16c0357e2147fe6bc7
https://doi.org/10.1109/ectc.2019.00053
https://doi.org/10.1109/ectc.2019.00053
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Thermocompression bonding (TCB) is an advantageous method adapted for system miniaturization, for instance to assemble microelectronic devices in 3D stacks. Low throughput and yield are the main drawbacks of TCB, which consequently can lead to higher
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bab78f4cb7b5c978472170dbbadf1a1c
https://doi.org/10.1109/ectc.2019.00267
https://doi.org/10.1109/ectc.2019.00267
Les bienfaits du lien humain-animal ne sont plus à prouver. Ces relations contribuent au développement harmonieux de l'être humain. Francine Guiet décrit quatre projets qui illustrent la force des bénéfices de la médiation animale. Le corps et
Autor:
Richard Langlois, Christy S. Tyberg, Ray Robertazzi, Pascale Gagnon, Katsuyuki Sakuma, Christian Bergeron, Michael Scheurmann, Stephane Barbeau, Steve Whitehead, Matthew Wordeman
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
3D multi-layer chip stacking is a significant assembly challenge with dependencies on die size and thickness, interconnect pitch, bump diameter, number of dies involved, and die warpage. The assembly processes used to overcome the technical difficult
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f68fda94bdd8009594878bd4d1c59cbc
https://doi.org/10.1109/ectc.2017.53
https://doi.org/10.1109/ectc.2017.53
Publikováno v:
Scientia Canadensis. 16:60-75
Florian Crête, membre des Clercs de St-Viateur, fait partie de la première génération des muséologues des sciences natrualies que le XXème siècle a produit au Québec. Dirigeant le Musée de l’institution des Sourds-Muets à Montréal, it fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8536c57740fdf27a22176f5597a5d596
https://doi.org/10.7202/800342ar
https://doi.org/10.7202/800342ar
Autor:
Jean-Pierre Després, S. Matthijs Boekholdt, John J.P. Kastelein, Erik S.G. Stroes, Kay-Tee Khaw, Nicholas J. Wareham, Pascale Gagnon, Benoit J. Arsenault, Isabelle Lemieux
Publikováno v:
Atherosclerosis, 206(1), 276-281. Elsevier Ireland Ltd
Objective: To evaluate the association between HDL particle size measured by gradient gel electrophoresis and risk of incident coronary heart disease (CHD) in apparently healthy men and women. Methods: We performed a prospective case-control study ne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94434587a4e93864af3512a557e74dac
https://pure.amc.nl/en/publications/hdl-particle-size-and-the-risk-of-coronary-heart-disease-in-apparently-healthy-men-and-women-the-epicnorfolk-prospective-population-study(805bbfe8-f032-4fc8-b2de-10e23cdbf2a7).html
https://pure.amc.nl/en/publications/hdl-particle-size-and-the-risk-of-coronary-heart-disease-in-apparently-healthy-men-and-women-the-epicnorfolk-prospective-population-study(805bbfe8-f032-4fc8-b2de-10e23cdbf2a7).html