Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Pascal Metzger"'
Autor:
Emilie Bourjot, Alice Bond, Carine Ladner, Nicolas Bresson, Stephane Moreau, Viorel Balan, Arnaud Cornelis, Renan Bouis, Catherine Euvrard, Noura Nadi, Loic Sanchez, Frank Fournel, Nicolas Raynaud, Pascal Metzger, Eric Ollier
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3eb2c123750f773a35e390f6631b05ac
https://doi.org/10.1109/estc55720.2022.9939476
https://doi.org/10.1109/estc55720.2022.9939476
Autor:
Emilie Bourjot, Noura Nadi, Frank Fournel, Loic Sanchez, Severine Cheramy, Nicolas Raynaud, C. Castan, Alice Bond, Pascal Metzger, N. Bresson
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Die-to-wafer direct hybrid bonding process is foreseen as a key enabler of heterogeneous 3D integration. Hybrid bonding technologies were first developed on W2W assembly reaching 3D interconnection pitch of $1\mu\mathrm{m}$ . Recently, CEA-Leti demon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c917550db9268c6ca7799fb49b0898b
https://doi.org/10.1109/ectc32696.2021.00085
https://doi.org/10.1109/ectc32696.2021.00085
Autor:
Severine Cheramy, A. Jouve, Frank Fournel, N. Bresson, Loic Sanchez, Nicolas Raynaud, Pascal Metzger
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
3D vertical integration of components is today an industrial reality. To reduce pitch of interconnection between the dice, the hydrid bonding technique, offering sub-10 $\mu$m interconnection pitch, is widely demonstrated for Wafer-to-Wafer bonding.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48087658efb30b91718f04cf534acaf7
https://doi.org/10.1109/estc.2018.8546471
https://doi.org/10.1109/estc.2018.8546471
Autor:
Caroline Avrillier, Pascal Metzger
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
This paper presents considerations on key parameters to obtain a high accuracy flip-chip bonding. Mutual interaction between three main blocks, the flip-chip bonder, the components to be bonded and the environment where the process is done is crucial
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c81a500d282d7ed15637ae6d181b25d9
https://doi.org/10.23919/empc.2017.8346863
https://doi.org/10.23919/empc.2017.8346863
