Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Pascal Limbecker"'
Publikováno v:
EDFA Technical Articles. 23:14-17
This article discusses the failure analysis challenges associated with large overmolded 2.5D packages and explains how laser decapsulation followed by microwave-induced plasma (MIP) spot etching removes overmold while keeping everything else intact.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10d70831cc87b3d8507776af657bb852
https://doi.org/10.31399/asm.edfa.2021-4.p014
https://doi.org/10.31399/asm.edfa.2021-4.p014
Autor:
Stephan Kleindiek, Rosalinda Ring, Klaus Schock, Andreas Rummel, Michael Zschornack, Pascal Limbecker, Andreas Meyer, Randy Newkirk, Kevin Davidson, Matthias Kemmler
Publikováno v:
EDFA Technical Articles. 20:24-33
Advances in IC technology have made failure site localization extremely challenging. Through a series of case studies, the authors of this article show how such challenges can be overcome using EBIC/EBAC, current imaging, and nanoprobing. The cases i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f439f6157646c6bfd44c2c934fa9ebf0
https://doi.org/10.31399/asm.edfa.2018-3.p024
https://doi.org/10.31399/asm.edfa.2018-3.p024
Autor:
Pascal Limbecker, Andreas Rummel, Klaus Schock, Matthias Kemmler, Michael Zschornack, Stephan Kleindiek, Andreas Meyer
Publikováno v:
Microelectronics Reliability. 64:313-316
Using a compact nanoprobing setup comprising eight probe tips attached to piezo-driven micromanipulators, various techniques for fault isolation are performed on 28 nm samples inside an SEM. The employed techniques include nanoprobing as well as EBAC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2210ebc33b6bb04dc9b427fe779795e
https://doi.org/10.1016/j.microrel.2016.07.024
https://doi.org/10.1016/j.microrel.2016.07.024
Autor:
Pascal Limbecker, Matthias Kemmler, Stephan Kleindiek, Michael Zschomack, Klaus Schock, Andreas Rummel, Andreas Meyer
Publikováno v:
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Using a compact nanoprobing setup comprising eight probe tips attached to piezo-driven micromanipulators, various techniques for fault isolation are performed on 28 nm samples inside an SEM. The recently implemented Current Imaging technique is used
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b996675f85f9afb118deb3c89ceffd69
https://doi.org/10.1109/ipfa.2016.7564288
https://doi.org/10.1109/ipfa.2016.7564288
Autor:
Eckhard Langer, Moritz Andreas Meyer, Pascal Limbecker, Dirk Utess, Axel Preusse, Oliver Aubel, Steffi Thierbach
Publikováno v:
EDFA Technical Articles. 10:24-29
With the introduction of 65 nm technology, the cross-sectional dimensions of copper interconnect in some layers are now smaller than 100 nm, which translates to current densities on the order of several MA/cm2. Electromigration as a root cause for ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a922ac8751921be4fe2d67f20b6fd91e
https://doi.org/10.31399/asm.edfa.2008-1.p024
https://doi.org/10.31399/asm.edfa.2008-1.p024