Intelligent Fault Analysis Decision Flow in Semiconductor Industry 4.0 Using Natural Language Processing with Deep Clustering

Autor: Kenneth Ezukwoke, Houari Toubakh, Xavier Boucher, Pascal Gounet, Mireille Batton-Hubert, Anis Hoayek

Publikováno v: IEEE 17th International Conference on Automation Science and Engineering (CASE)
IEEE 17th International Conference on Automation Science and Engineering (CASE), Aug 2021, Lyon, France. p 429-436
CASE

International audience; Microelectronics production failure analysis is a time-consuming and complicated task involving successive steps of analysis of complex process chains. The analysis is triggered to find the root cause of a failure and its find

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::032cfcda7a65e7fb8ecaeefbecd04718
https://hal-emse.ccsd.cnrs.fr/emse-03325358

Rapid cross-sectioning of challenging samples using a combination of TRUE X-sectioning and the rocking stage techniques

Autor: Tomas Hmcir, Marek Šikula, Pascal Gounet

Publikováno v: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

An advanced sample preparation protocol using Xe+ Plasma FIB for cross-sections wider than 400 μm is proposed. Challenging samples such as a BGA (CSP) or chip in a package often suffer from FIB milling artifacts. The results are unsatisfactory mainl

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::bc63d5e2982e2cfbb9f2f0e207f0d4e8
https://doi.org/10.1109/ipfa.2017.8060168

New method for decapsulation of copper wire devices using LASER and sub-ambient temperature chemical etch

Autor: Jackie Yang, Sandrine Barberan, Pascal Gounet, Michael Obein, Matthew J. Lefevre, Frederic Beauquis

Publikováno v: 2011 IEEE 13th Electronics Packaging Technology Conference.

IC packages have been greatly improved over the past several years. With the adoption of Cu wires and new green EMC (Epoxy Molding Compound), the suppression of lead, the use of Cu pillars and the increased number of dies, the verification of the qua

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b952dea2b417069eed88b17faeba24f6
https://doi.org/10.1109/eptc.2011.6184523

FIB process for selective and clean etching copper in high aspect ratio holes

Autor: Vladimir V. Makarov, Kirill V. Makarov, Pascal Gounet, Leo Ya. Krasnobaev

Publikováno v: 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

A new solution for etching copper over low-k dielectrics using FIB for circuit edit purposes is presented and compared to the existing two copper etch solutions. For the comparison, a copper line buried under several microns of dielectric and embedde

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::16a26299ea5e81bcb51f61ef0d94f45e
https://doi.org/10.1109/ipfa.2010.5532304