Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Parviziomran, Irandokht"'
Autor:
Parviziomran, Irandokht, Mahmoudi, Monireh ⁎
Publikováno v:
In Multimodal Transportation December 2024 3(4)
The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, because the shift is considered to be negligibly small and the following
Externí odkaz:
http://arxiv.org/abs/2002.07807
In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste with some fluid properties could slump and the unbalance between differen
Externí odkaz:
http://arxiv.org/abs/2002.01527
In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fluid dynamic behaviour of molten solder paste. This capability is criti
Externí odkaz:
http://arxiv.org/abs/2001.09619
Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are permanently attached on PCB with the aim of reflow soldering process. Dur
Externí odkaz:
http://arxiv.org/abs/2001.09612
Publikováno v:
In Computers & Industrial Engineering March 2023 177
Publikováno v:
In International Journal of Production Economics October 2020 228
Publikováno v:
In Procedia Manufacturing 2019 38:217-224
Publikováno v:
In Procedia Manufacturing 2019 38:100-107
Publikováno v:
International Journal of Productivity and Quality Management; 2018, Vol. 24 Issue: 4 p495-506, 12p