Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Parthiban Arunasalam"'
Autor:
Fadi Alsaleem, Mehari K. Tesfay, Mostafa Rafaie, Kevin Sinkar, Dhaman Besarla, Parthiban Arunasalam
Publikováno v:
Frontiers in Built Environment, Vol 6 (2020)
Humans spend more than 90% of their day in buildings, where their health and productivity are demonstrably linked to thermal comfort. Building thermal comfort systems account for the largest share of U.S energy consumption. Despite this high-energy c
Externí odkaz:
https://doaj.org/article/627ed68883024f5a9b82ad3d763d793c
Publikováno v:
Building and Environment. 133:151-160
In many refrigeration and air-conditioning systems, the automatic controller in electronic expansion valves have been employed as a component responsible for controlling the valve opening so that the superheat at the outlet of the evaporator remains
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c748a10d63c98de5225492c515d5b685
https://doi.org/10.1016/j.buildenv.2018.02.015
https://doi.org/10.1016/j.buildenv.2018.02.015
Publikováno v:
EIT
In many refrigeration and air-conditioning systems, the automatic controller in electronic expansion valves have been employed as a component responsible for controlling the valve opening so that the superheat at the outlet of the evaporator remains
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22e5323bf0abb1447aa67eebe95441c2
https://doi.org/10.1109/eit.2017.8053348
https://doi.org/10.1109/eit.2017.8053348
Autor:
Kankanhalli N. Seetharamu, J. Kadesan, M. Ramasamy, Parthiban Arunasalam, M. R. A. Hassan, I. A. Azid, Alan Shu Khen Kwan
Publikováno v:
Structural Engineering and Mechanics. 35:83-98
In this paper, the mass optimization of four bar linkages is carried out using genetic algorithms (GA) with single and dual constraints. The single constraint of bending stress and the dual constraints of bending and buckling stresses are imposed. Fr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2180f4b3ef24b603b86673b9a36c3eb7
https://doi.org/10.12989/sem.2010.35.1.083
https://doi.org/10.12989/sem.2010.35.1.083
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 33:16-24
Thermal management of device-level packaging continues to present many technical challenges in the electronics industry. In a device/heat sink assembly, the highest resistance to heat flow typically comes from the thermal interface material (TIM). Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efdcff7896178f810ac0ca8462cb83db
https://doi.org/10.1109/tcapt.2009.2018834
https://doi.org/10.1109/tcapt.2009.2018834
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 3:86-94
The present trend in electronics packaging is the stacking of die at the wafer or chip level. However to ensure stacked chip packages maintain overall low height and weight package profile, silicon wafers have to undergo extensive wafer thinning proc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae910f0a6b9df43382cadb20f78950f8
https://doi.org/10.4071/1551-4897-3.2.86
https://doi.org/10.4071/1551-4897-3.2.86
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 28:345-352
Genetic Algorithms (GA) are adaptive search algorithms based on the theory of natural selection and survival of the fittest. In this study, GA was used to derive a thermal compact model of a micro lead frame package. The GA derived model was then use
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21876402d4e3ee5f3e0866f9b7093c93
https://doi.org/10.1109/tcapt.2005.848538
https://doi.org/10.1109/tcapt.2005.848538
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
Solders have been utilized extensively in the MEMS packaging industry to create vacuum or hermetic seals in a variety of applications. MEMS technology is finding applications in wide range of products like pressure sensors, actuators, flow control de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2b1e749d369c9535f996c1b3a6d891b
https://doi.org/10.1115/ipack2011-52296
https://doi.org/10.1115/ipack2011-52296
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Thermal management of device level packaging continues to present many technical challenges. In the typical chip heat sink assembly, the highest resistance to heat flow comes from the thermal interface material (TIM). The thermal conductivities of TI
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee087937d650e1d7c4b39574f8bf029
https://doi.org/10.1109/itherm.2008.4544380
https://doi.org/10.1109/itherm.2008.4544380
Autor:
Parthiban Arunasalam, Hing Wah Lee, Ishak Abd Azid, Kankanhalli N. Seetharamu, William P. Laratta
Publikováno v:
Journal of biomechanical engineering. 129(4)
In this study, a hybridized neuro-genetic optimization methodology realized by embedding finite element analysis (FEA) trained artificial neural networks (ANN) into genetic algorithms (GA), is used to optimize temperature control in a ceramic based c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::31c290e7b838f73b63f6dda9c99ad844
https://pubmed.ncbi.nlm.nih.gov/17655475
https://pubmed.ncbi.nlm.nih.gov/17655475